PESD3V3L1UA_UB_UL: 低电容单向ESD保护二极管
低电容单向静电放电(ESD)保护二极管采用小型表面贴装设备(SMD)塑料封装，保护单条信号线，使其免受ESD和其他瞬态电压导致的损坏。
PESD3V3L1UA_UB_UL: 产品结构框图
PESD3V3L1UA_UB_UL: 应用结构框图
PESD3V3L1UA_UB_UL: 应用结构框图
sod523_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Low capacitance unidirectional ESD protection diodes (REV 1.0) PDF (113.0 kB) PESD3V3L1UA_UB_UL [English] | 23 Jun 2009 |
封装信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (174.0 kB) SOD523 [English] | 08 Feb 2016 |
| DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English] | 08 Feb 2016 |
包装 (2)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (179.0 kB) SOD523_115 [English] | 07 Nov 2012 |
| Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English] | 07 Nov 2012 |
可靠性与质量信息 (4)
| 名称/描述 | Modified Date |
|---|---|
| PESD3V3L1UB NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L1UB [English] | 31 Jan 2015 |
| PESD3V3L1UB NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L1UB_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PESD3V3L1UL NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L1UL [English] | 31 Jan 2015 |
| PESD3V3L1UL NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L1UL_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PESD3V3L1UB SPICE model (REV 1.4) prm PESD3V3L1UB_1 7/22/2012
- PESD3V3L1UL SPICE model (REV 1.4) prm PESD3V3L1UL_1 7/22/2012
订购信息
| 型号 | 状态 |
|---|---|
| PESD3V3L1UL | Active |
| PESD3V3L1UB | Active |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD3V3L1UL |  | SOD882 | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD3V3L1UL,315 (9340 629 88315) | XW | PESD3V3L1UL |    | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
| PESD3V3L1UB | | SOD523 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PESD3V3L1UB,115 (9340 632 21115) | Z7 | PESD3V3L1UB | | Always Pb-free | 244.0 | 1.13 | 8.85E8 | 1 | 1 |
- PESD3V3L1UB NXP® Product Reliability pesd3v3l1ub
- PESD3V3L1UB NXP® Product Quality pesd3v3l1ub
- PESD3V3L1UL NXP® Product Reliability pesd3v3l1ul
- PESD3V3L1UL NXP® Product Quality pesd3v3l1ul
- PESD3V3L1UB SPICE model PESD3V3L1UB
- PESD3V3L1UL SPICE model PESD3V3L1UL
- DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
- Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
- plastic surface-mounted package; 2 leads pesd5z7.0
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5z7.0
- PTVSXS1UR_SERIES
- PESD5V0X1BL
- 1PSXSB17
- 1PS10SB82
- BB208-02
