PESD3V3L5UV: 低电容单向五倍ESD保护二极管阵列

低电容单向五倍静电放电(ESD)保护二极管阵列采用小型表面贴装设备(SMD)塑料封装,保护最多5条单向信号线免受ESD和其他瞬态电压导致的损坏。

SOT666
数据手册 (1)
名称/描述Modified Date
Low capacitance unidirectional fivefold ESD protection diode arrays (REV 2.0) PDF (106.0 kB) PESDXL5UF_V_Y [English]08 Jan 2008
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 6 leads (REV 1.0) PDF (188.0 kB) SOT666 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT666_115 [English]29 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PESD3V3L5UV NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L5UV [English]31 Jan 2015
PESD3V3L5UV NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L5UV_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
软件
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD3V3L5UVActiveSOT666SOT6661.6 x 1.2 x 0.555Unidirectional22283.3200.3
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD3V3L5UVSOT666Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD3V3L5UV,115 (9340 577 96115)E1PESD3V3L5UVAlways Pb-free244.01.138.85E811
Low capacitance unidirectional fivefold ESD protection diode arrays pesd5v0l5uy
PESD3V3L5UV NXP® Product Reliability pesd3v3l5uv
PESD3V3L5UV NXP® Product Quality pesd3v3l5uv
PESD3V3L5UV SPICE model PESDXL5UF_PESDXL5UV_PESDXL5UY
PESD3V3L5UY_1_2_3 PESDXL5UF_PESDXL5UV_PESDXL5UY
PESD5V0L5UY_1_2_3 PESDXL5UF_PESDXL5UV_PESDXL5UY
plastic surface-mounted package; 6 leads BSS84AKV
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKV
1PSXSB17