PESD3V3S4UF; PESD5V0S4UF: 单向四倍ESD保护二极管阵列

单向四倍静电放电(ESD)保护二极管阵列采用小型SOT886表面贴装设备(SMD)塑料封装,保护最多四条信号线免受ESD和其他瞬态电压导致的损坏。

PESD3V3S4UF_PESD5V0S4UF: 产品结构框图
PESD3V3S4UF_PESD5V0S4UF: 应用结构框图
Outline 3d SOT886
数据手册 (1)
名称/描述Modified Date
Unidirectional quadruple ESD protection diode arrays (REV 1.0) PDF (84.0 kB) PESD3V3S4UF_PESD5V0S4UF [English]17 Jan 2008
应用说明 (1)
名称/描述Modified Date
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
封装信息 (1)
名称/描述Modified Date
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]23 Apr 2013
可靠性与质量信息 (4)
名称/描述Modified Date
PESD3V3S4UF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3S4UF [English]31 Jan 2015
PESD3V3S4UF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3S4UF_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PESD5V0S4UF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0S4UF [English]31 Jan 2015
PESD5V0S4UF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0S4UF_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
SPICE
订购信息
型号状态
PESD5V0S4UFActive
PESD3V3S4UFActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD3V3S4UFSOT886Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD3V3S4UF,115 (9340 611 96115)A3PESD3V3S4UFAlways Pb-free244.01.138.85E811
PESD5V0S4UFSOT886Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0S4UF,115 (9340 612 01115)A4PESD5V0S4UFAlways Pb-free244.01.138.85E811
Unidirectional quadruple ESD protection diode arrays pesd5v0s4uf
MicroPak soldering information NTS0102_Q100
PESD3V3S4UF NXP® Product Reliability pesd3v3s4uf
PESD3V3S4UF NXP® Product Quality pesd3v3s4uf
PESD5V0S4UF NXP® Product Reliability pesd5v0s4uf
PESD5V0S4UF NXP® Product Quality pesd5v0s4uf
MAR_SOT886 Topmark prtr5v0u2f
PESD3V3S4UF SPICE model PESD3V3S4UF_PESD5V0S4UF
PESD5V0S4UF SPICE model PESD5V0S4UF
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
PESDXS4UD_SERIES
PESD3V3S4UF_PESD5V0S4UF
BGU8007