PESD3V3V4UW: 极低电容单向四倍ESD保护二极管阵列

极低电容单向四倍静电放电(ESD)保护二极管阵列采用小型表面贴装设备(SMD)塑料封装,保护最多四条信号线免受ESD和其他瞬态电压导致的损坏。

sot665_3d
数据手册 (1)
名称/描述Modified Date
Very low capacitance unidirectional quadruple ESD protection diode arrays (REV 3.0) PDF (108.0 kB) PESDXV4UF_G_W [English]28 Jan 2008
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English]03 Dec 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PESD3V3V4UW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3V4UW [English]31 Jan 2015
PESD3V3V4UW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3V4UW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD3V3V4UWActiveSOT665SOT6651.6 x 1.2 x 0.554Unidirectional15183.3120.3
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD3V3V4UWSOT665Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD3V3V4UW,115 (9340 591 76115)W1PESD3V3V4UWAlways Pb-free244.01.138.85E811
Very low capacitance unidirectional quadruple ESD protection diode arrays pesd5v0v4uw
PESD3V3V4UW NXP® Product Reliability pesd3v3v4uw
PESD3V3V4UW NXP® Product Quality pesd3v3v4uw
PESD3V3V4UW SPICE model PESDXV4UF_PESDXV4UG_PESDXV4UW
plastic surface-mounted package; 5 leads pesd5v0v4uw
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw
IP4256CZ3_M_CZ5_W_CZ6_F