PESD5V0S1ULD: 单向ESD保护二极管
单向静电放电(ESD)保护二极管设计用于保护单条信号线，使其免受ESD和其他瞬态电压导致的损坏。该器件采用超小型无引脚SOD882D表面贴装设备(SMD)塑料封装，具有可见且可焊的侧焊盘。
-
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Unidirectional ESD protection diode (REV 1.0) PDF (276.0 kB) PESD5V0S1ULD [English] | 22 Oct 2010 |
手册 (2)
| 名称/描述 | Modified Date |
|---|---|
| NXP® SOD882D package, First leadless package with tin-plated, solderable side pads (REV 2.0) PDF (1.8 MB) 75017130 [English] | 06 Jun 2011 |
| The first leadless package with solderable side pads (REV 1.0) PDF (228.0 kB) POSTER_SOD882D [English] | 21 Oct 2010 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D [English] | 08 Feb 2016 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PESD5V0S1ULD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0S1ULD_1 [English] | 31 Jan 2015 |
| PESD5V0S1ULD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0S1ULD_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PESD5V0S1ULD SPICE model (REV 1.1) prm PESD5V0S1ULD_1_2 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | No of protected lines | Configuration | Cd [typ] (pF) | Cd [max] (pF) | VRWM (V) | VESD IEC61000-4-2 (kV) | IRM [max] (µA) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0S1ULD | Active | SOD882D | DFN1006D-2 | 1 x 0.6 x 0.4 | 1 | Unidirectional | 152 | 200 | 5 | 30 | 1 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PESD5V0S1ULD | | SOD882D | Reflow_Soldering_Profile | Reel 7" Q1/T1 Pitch 2mm | Active | PESD5V0S1ULD,315 (9340 645 64315) | 0100 0000 | PESD5V0S1ULD |    | Always Pb-free | 117.0 | 0.54 | 1.85E9 | 1 | 1 |
- Unidirectional ESD protection diode pesd5v0s1uld
- NXP® SOD882D package, First leadless package with tin-plated, solderable side pads pesd5v0s1uld
- The first leadless package with solderable side pads pesd5v0s1uld
- PESD5V0S1ULD NXP® Product Reliability pesd5v0s1uld
- PESD5V0S1ULD NXP® Product Quality pesd5v0s1uld
- PESD5V0S1ULD SPICE model PESD5V0S1ULD
- DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- BB187LX
