PESD5V0S2BQA: Protection against high surge currents in ultra small DFN1010D-3 package

Two bidirectional ElectroStatic Discharge (ESD) protection diodes designed to protect two signal lines from the damage caused by ESD and other transients.

The device is housed in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

sot1215_3d
数据手册 (1)
名称/描述Modified Date
Protection against high surge currents in ultra small DFN1010D-3 package (REV 1.0) PDF (352.0 kB) PESD5V0S2BQA_1 [English]01 Jun 2016
封装信息 (1)
名称/描述Modified Date
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm (REV 1.0) PDF (191.0 kB) SOT1215 [English]08 Feb 2016
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD5V0S2BQAActiveSOT1215DFN1010D-31.1 x 1.0 x 0.37
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
PESD5V0S2BQASOT1215Reflow_Soldering_ProfileReel 7" Q2/T3ActivePESD5V0S2BQAZ (9340 695 38147)00 01 10PESD5V0S2BQAAlways Pb-free11
Protection against high surge currents in ultra small DFN1010D-3 package PESD5V0S2BQA
DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm PBSS5260QA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
LOW_RDSON_MOSFETS_IN_ULTRA_SMALL_DFN1010_SINGLE_AND_DUAL_PACKAGE