PESDxL4UF; PESDxL4UG; PESDxL4UW: 低电容单向四倍ESD保护二极管阵列

低电容单向四倍静电放电(ESD)保护二极管阵列采用小型表面贴装设备(SMD)塑料封装,保护最多四条信号线免受ESD和其他瞬态电压导致的损坏。

sot665_3d
数据手册 (1)
名称/描述Modified Date
Low capacitance unidirectional quadruple ESD protection diode arrays (REV 4.0) PDF (111.0 kB) PESDXL4UF_G_W [English]28 Feb 2008
应用说明 (1)
名称/描述Modified Date
MicroPak soldering information (REV 2.0) PDF (245.0 kB) AN10343 [English]30 Dec 2010
封装信息 (3)
名称/描述Modified Date
plastic surface-mounted package; 5 leads (REV 1.0) PDF (245.0 kB) SOT353 [English]08 Feb 2016
plastic surface-mounted package; 5 leads (REV 1.0) PDF (186.0 kB) SOT665 [English]08 Feb 2016
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm (REV 1.0) PDF (189.0 kB) SOT886 [English]08 Feb 2016
包装 (3)
名称/描述Modified Date
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... (REV 2.0) PDF (205.0 kB) SOT886_115 [English]23 Apr 2013
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (235.0 kB) SOT665_115 [English]03 Dec 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (191.0 kB) SOT353_115 [English]16 Nov 2012
可靠性与质量信息 (10)
名称/描述Modified Date
PESD3V3L4UG NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L4UG [English]31 Jan 2015
PESD3V3L4UG NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L4UG_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PESD3V3L4UW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD3V3L4UW [English]31 Jan 2015
PESD3V3L4UW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD3V3L4UW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PESD5V0L4UF NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L4UF [English]31 Jan 2015
PESD5V0L4UF NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L4UF_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PESD5V0L4UG NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L4UG [English]31 Jan 2015
PESD5V0L4UG NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L4UG_NXP_PRODUCT_QUALITY [English]31 Jan 2015
PESD5V0L4UW NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L4UW [English]31 Jan 2015
PESD5V0L4UW NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L4UW_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (4)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT353 Topmark (REV 1.0) PDF (103.0 kB) MAR_SOT353 [English]03 Jun 2013
MAR_SOT886 Topmark (REV 1.0) PDF (73.0 kB) MAR_SOT886 [English]03 Jun 2013
SPICE
订购信息
型号状态
PESD5V0L4UFActive
PESD3V3L4UGActive
PESD3V3L4UWActive
PESD5V0L4UWActive
PESD5V0L4UGActive
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD5V0L4UFSOT886Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0L4UF,115 (9340 611 98115)A6PESD5V0L4UFAlways Pb-free244.01.138.85E811
PESD5V0L4UGSOT353Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePESD5V0L4UG,115 (9340 577 85115)L2%PESD5V0L4UGweek 31, 2003244.01.138.85E811
PESD3V3L4UWSOT665Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD3V3L4UW,115 (9340 577 91115)A2PESD3V3L4UWAlways Pb-free244.01.138.85E811
PESD5V0L4UWSOT665Reflow_Soldering_ProfileReel 7" Q1/T1ActivePESD5V0L4UW,115 (9340 577 92115)A1PESD5V0L4UWAlways Pb-free244.01.138.85E811
PESD3V3L4UGSOT353Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePESD3V3L4UG,115 (9340 577 84115)L1%PESD3V3L4UGweek 31, 2003244.01.138.85E811
Low capacitance unidirectional quadruple ESD protection diode arrays pesd5v0l4uw
MicroPak soldering information NTS0102_Q100
PESD3V3L4UG NXP® Product Reliability pesd3v3l4ug
PESD3V3L4UG NXP® Product Quality pesd3v3l4ug
PESD3V3L4UW NXP® Product Reliability pesd3v3l4uw
PESD3V3L4UW NXP® Product Quality pesd3v3l4uw
PESD5V0L4UF NXP® Product Reliability pesd5v0l4uf
PESD5V0L4UF NXP® Product Quality pesd5v0l4uf
PESD5V0L4UG NXP® Product Reliability pesd5v0l4ug
PESD5V0L4UG NXP® Product Quality pesd5v0l4ug
PESD5V0L4UW NXP® Product Reliability pesd5v0l4uw
PESD5V0L4UW NXP® Product Quality pesd5v0l4uw
MAR_SOT353 Topmark 74LVC1G17_Q100
MAR_SOT886 Topmark prtr5v0u2f
PESD3V3L4UG SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW
PESD3V3L4UW SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW
PESD5V0L4UF SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW
PESD5V0L4UG SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW
PESD5V0L4UW SPICE model PESDXL4UF_PESDXL4UG_PESDXL4UW
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm prtr5v0u2f
XSON6; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering... prtr5v0u2f
plastic surface-mounted package; 5 leads pesd5v0v4uw
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4uw
plastic surface-mounted package; 5 leads NX3L1G66GW-Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0v4ug
BGU8007
IP4256CZ3_M_CZ5_W_CZ6_F
NCX2202