PMEG2010BELD: 20 V、1 A低VF MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用超小型无引脚SOD882D (DFN1006D-2)表面贴装设备(SMD)塑料封装,具有可见且可焊的侧焊盘。

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数据手册 (1)
名称/描述Modified Date
20 V, 1 A low VF MEGA Schottky barrier rectifier (REV 2.0) PDF (206.0 kB) PMEG2010BELD [English]04 Aug 2015
应用说明 (1)
名称/描述Modified Date
Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 [English]06 Mar 2015
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
DFN1006D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (182.0 kB) SOD882D [English]08 Feb 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG2010BELD NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2010BELD_1 [English]31 Jan 2015
PMEG2010BELD NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2010BELD_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)Remark
PMEG2010BELDActiveSOD882DDFN1006D-21 x 0.6 x 0.4120single0,05@VR=20V631@VR=1V490@IF=1Asolderable side pads
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG2010BELDSOD882DReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePMEG2010BELD,315 (9340 668 36315)0000 1001PMEG2010BELDAlways Pb-free157.00.731.37E911
20 V, 1 A low VF MEGA Schottky barrier rectifier PMEG2010BELD
Leadless Schottky diodes in a DC-to-DC step-up converter PMEG6020EPA
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG2010BELD NXP® Product Reliability PMEG2010BELD
PMEG2010BELD NXP® Product Quality PMEG2010BELD
PMEG2010BELD SPICE model PMEG2010BELD
DFN1006D-2: leadless ultra small plastic package; 2 terminals pesd5v0x1uld
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
BB187LX