PMEG2015EPK: 20 V、1.5 A低VF MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用超小型无引脚DFN1608D-2 (SOD1608)表面贴装设备(SMD)塑料封装,具有可见且可焊的侧焊盘。

SOD1608
数据手册 (1)
名称/描述Modified Date
20 V, 1.5 A low VF MEGA Schottky barrier rectifier (REV 1.0) PDF (1.1 MB) PMEG2015EPK [English]06 Mar 2012
应用说明 (1)
名称/描述Modified Date
Leadless Schottky diodes in a DC-to-DC step-up converter (REV 1.1) PDF (562.0 kB) AN11470 [English]06 Mar 2015
手册 (2)
名称/描述Modified Date
适用于便携设备和移动电话... (REV 1.0) PDF (4.9 MB) 939775017444_ZH [English]28 Oct 2013
Discretes for portable devices and mobile handsets (REV 1.1) PDF (3.9 MB) 939775017444 [English]04 Sep 2013
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (2)
名称/描述Modified Date
DFN1608D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (179.0 kB) SOD1608 [English]08 Feb 2016
SOD1608 (REV -) GIF (3.0 kB) SOD1608_SV_1 [English]
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG2015EPK NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG2015EPK_1 [English]31 Jan 2015
PMEG2015EPK NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG2015EPK_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)Remark
PMEG2015EPKActiveSOD1608DFN1608D-21.6 x 0.8 x 0.37120single420@IF=1,5A5105@VR=1V0,9@VR=20Vsolderable side pads
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG2015EPKSOD1608Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePMEG2015EPK,315 (9340 653 82315)1100 0000PMEG2015EPKAlways Pb-free157.00.731.37E911
20 V, 1.5 A low VF MEGA Schottky barrier rectifier PMEG2015EPK
Leadless Schottky diodes in a DC-to-DC step-up converter PMEG6020EPA
适用于便携设备和移动电话... ptvsxs1ur_automotive
Discretes for portable devices and mobile handsets ptvsxs1ur_automotive
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
SOD1608 PMEG4020EPK
PMEG2015EPK NXP® Product Reliability PMEG2015EPK
PMEG2015EPK NXP® Product Quality PMEG2015EPK
PMEG2015EPK SPICE model PMEG2015EPK
DFN1608D-2: leadless ultra small plastic package; 2 terminals PMEG4020EPK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN1608D_2_SCHOTTKY_RECTIFIER_SERIES