PMEG3010BEA: 1 A、低VF MEGA肖特基势垒整流器 _ BDTIC 中国领先电子元器件代理商

PMEG3010BEA: 1 A、低VF MEGA肖特基势垒整流器

平面高能效通用型(MEGA)肖特基势垒整流器集成应力保护环，采用极小型SOD323 (SC-76)表面贴装器件(SMD)塑料封装。

PMEG3010BEA: 产品结构框图

PMEG3010BEA: 应用结构框图

PMEG3010BEA: 应用结构框图

sod323_3d

数据手册 (1)

名称/描述	Modified Date
1 A very low VF MEGA Schottky barrier rectifier in ultra small SOT666 and in very small SOD323 (SC-76) package (REV 4.0) PDF (158.0 kB) PMEGXX10BEA_PMEGXX10BEV [English]	14 Jun 2004

选型工具指南 (1)

名称/描述	Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]	17 Feb 2016

封装信息 (1)

名称/描述	Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (200.0 kB) SOD323 [English]	08 Feb 2016

包装 (2)

名称/描述	Modified Date
Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (183.0 kB) SOD323_115 [English]	07 Nov 2012
Tape reel; standard product orientation 12NC ending 135 (REV 1.0) PDF (183.0 kB) SOD323_135 [English]	07 Nov 2012

可靠性与质量信息 (2)

名称/描述	Modified Date
PMEG3010BEA NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3010BEA [English]	31 Jan 2015
PMEG3010BEA NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3010BEA_NXP_PRODUCT_QUALITY [English]	31 Jan 2015

支持信息 (2)

名称/描述	Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]	30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]	30 Sep 2013

SPICE

PMEG3010BEA SPICE model (REV 1.4) prm PMEG3010BEA_1 7/22/2012

订购信息

型号	状态	Package version	Package name	大小 (mm)	I_F (A)	V_R (V)	Configuration	I_R [max] (mA)	I_FSM [max] (A)	C_d [max] (pF)	V_F [max] (mV)
PMEG3010BEA	Active	SOD323	SOD323	1.7 x 1.25 x 0.95	1	30	single	0,15@VR=30V	10	70@VR=1V	560@IF=1A
PMEG3010BEA/A	No Longer Manufactured	SOD323	SOD323	1.7 x 1.25 x 0.95	1	30	single	0,15@VR=30V	10	70@VR=1V	560@IF=1A
PMEG3010BEA/DG	No Longer Manufactured	SOD323	SOD323	1.7 x 1.25 x 0.95	1	30	single	0,15@VR=30V	10	70@VR=1V	560@IF=1A
PMEG3010BEA/A2	No Longer Manufactured	SOD323	SOD323	1.7 x 1.25 x 0.95	1	30	single	0,15@VR=30V	10	70@VR=1V	560@IF=1A

封装环保信息

产品编号	封装说明	Outline Version	回流/波峰焊接	包装	产品状态	部件编号订购码 (12NC)	Marking	化学成分	RoHS / 无铅 / RHF	无铅转换日期	EFR	IFR(FIT)	MTBF（小时）	MSL	MSL LF
PMEG3010BEA		SOD323	Reflow_Soldering_Profile Wave_Soldering_Profile Reflow_Soldering_Profile Wave_Soldering_Profile	Reel 11¼" Q1/T1 in LargePack	Active	PMEG3010BEA,135 (9340 579 17135)	V2	PMEG3010BEA		Always Pb-free	157.0	0.73	1.37E9	1	1
				Reel 7" Q1/T1	Active	PMEG3010BEA,115 (9340 579 17115)	V2	PMEG3010BEA		week 31, 2003	157.0	0.73	1.37E9	1	1
				Reel 7" Q1/T1 in Multi reel pack	Active	PMEG3010BEAZ (9340 579 17145)	V2	PMEG3010BEA		Always Pb-free	157.0	0.73	1.37E9	1	1

1 A very low VF MEGA Schottky barrier rectifier in ultra small SOT666 and in very small SOD323 (SC-76) package PMEG4010BEV

Discretes Semiconductors Selection Guide 2016 BUK7M12-60E

PMEG3010BEA NXP® Product Reliability PMEG3010BEA

PMEG3010BEA NXP® Product Quality PMEG3010BEA

PMEG3010BEA SPICE model PMEGXX10BEA_PMEGXX10BEV

plastic surface-mounted package; 2 leads pesd5v0v1ba

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20

Tape reel; standard product orientation 12NC ending 135 pesd5v0u1ba

Tape reel; standard product orientation 12NC ending 115 pesd5v0v1ba

PMEGXX10BEA_PMEGXX10BEV

PMEGXX10BEA_PMEGXX10BEV

BB208-03

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