PMEG3020EPAS: 30 V, 2 A low VF MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

sot1061d_3d
数据手册 (1)
名称/描述Modified Date
30 V, 2 A low VF MEGA Schottky barrier rectifier (REV 2.0) PDF (224.0 kB) PMEG3020EPAS [English]19 Jan 2015
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (192.0 kB) SOT1061D [English]08 Feb 2016
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)Remark
PMEG3020EPASActiveSOT1061DDFN2020D-32 x 2 x 0.65230single470@IF=2A1755@VR=10V2,5@VR=30Vsolderable side pads
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG3020EPASSOT1061DReel 7" Q1/T1ActivePMEG3020EPASX (9340 681 51115)CPPMEG3020EPASAlways Pb-free157.00.731.37E911
30 V, 2 A low VF MEGA Schottky barrier rectifier PMEG3020EPAS
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG3020EPAS SPICE Model PMEG3020EPAS
DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm BC56PAS
DFN2020D_3_SCHOTTKY_RECTIFIER_SERIES