Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
名称/描述 | Modified Date |
---|---|
30 V, 2 A low VF MEGA Schottky barrier rectifier (REV 2.0) PDF (224.0 kB) PMEG3020EPAS [English] | 19 Jan 2015 |
名称/描述 | Modified Date |
---|---|
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
名称/描述 | Modified Date |
---|---|
DFN2020D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (192.0 kB) SOT1061D [English] | 08 Feb 2016 |
型号 | 状态 | Package version | Package name | 大小 (mm) | IF (A) | VR (V) | Configuration | VF [max] (mV) | IFSM [max] (A) | Cd [max] (pF) | IR [max] (mA) | Remark |
---|---|---|---|---|---|---|---|---|---|---|---|---|
PMEG3020EPAS | Active | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | 2 | 30 | single | 470@IF=2A | 17 | 55@VR=10V | 2,5@VR=30V | solderable side pads |
产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF(小时) | MSL | MSL LF |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PMEG3020EPAS | SOT1061D | Reel 7" Q1/T1 | Active | PMEG3020EPASX (9340 681 51115) | CP | PMEG3020EPAS | Always Pb-free | 157.0 | 0.73 | 1.37E9 | 1 | 1 |