PMEG4005EPK: 40 V、0.5 A低VF MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用超小型无引脚DFN1608D-2 (SOD1608)表面贴装设备(SMD)塑料封装,具有可见且可焊的侧焊盘。

SOD1608
数据手册 (1)
名称/描述Modified Date
40 V, 0.5 A low VF MEGA Schottky barrier rectifier (REV 2.0) PDF (1.1 MB) PMEG4005EPK [English]06 Mar 2012
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (2)
名称/描述Modified Date
DFN1608D-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (179.0 kB) SOD1608 [English]08 Feb 2016
SOD1608 (REV -) GIF (3.0 kB) SOD1608_SV_1 [English]
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG4005EPK NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG4005EPK_1 [English]31 Jan 2015
PMEG4005EPK NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG4005EPK_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationVF [max] (mV)IFSM [max] (A)Cd [max] (pF)IR [max] (mA)Remark
PMEG4005EPKActiveSOD1608DFN1608D-21.6 x 0.8 x 0.370.540single590@IF=0,5A330@VR=1V0,01@VR=40Vsolderable side pads
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG4005EPKSOD1608Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePMEG4005EPK,315 (9340 653 83315)0010 0000PMEG4005EPKAlways Pb-free157.00.731.37E911
40 V, 0.5 A low VF MEGA Schottky barrier rectifier PMEG4005EPK
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
SOD1608 PMEG4020EPK
PMEG4005EPK NXP® Product Reliability PMEG4005EPK
PMEG4005EPK NXP® Product Quality PMEG4005EPK
PMEG4005EPK SPICE model PMEG4005EPK
DFN1608D-2: leadless ultra small plastic package; 2 terminals PMEG4020EPK
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN1608D_2_SCHOTTKY_RECTIFIER_SERIES