RB520CS3002L: 200 mA低VF MEGA肖特基势垒整流器

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用DFN1006-2 (SOD882)超小型无引脚表面贴装器件(SMD)塑料封装。

sod882_3d
数据手册 (1)
名称/描述Modified Date
200 mA low VF MEGA Schottky barrier rectifier (REV 1.0) PDF (199.0 kB) RB520CS3002L [English]25 Jun 2013
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
DFN1006-2: leadless ultra small plastic package; 2 terminals (REV 1.0) PDF (174.0 kB) SOD882 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 315 (REV 1.0) PDF (240.0 kB) SOD882_315 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
RB520CS3002L NXP® Product Reliability (REV 1.1) PDF (83.0 kB) RB520CS3002L_1 [English]31 Jan 2015
RB520CS3002L NXP Product Quality (REV 1.2) PDF (74.0 kB) RB520CS3002L_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)VR [max] (V)IF [max] (mA)IFSM [max] (A)ConfigurationVF [max] (mV)Cd [max] (pF)IR [max] (mA)IR [max] (µA)
RB520CS3002LActiveSOD882DFN1006-21.0 x 0.6 x 0.5302003single640100.5
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
RB520CS3002LSOD882Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveRB520CS3002LYL (9340 678 37315)ZARB520CS3002LAlways Pb-free157.00.731.37E911
200 mA low VF MEGA Schottky barrier rectifier RB520CS3002L
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
RB520CS3002L NXP® Product Reliability RB520CS3002L
RB520CS3002L NXP Product Quality RB520CS3002L
RB520CS3002L SPICE model RB520CS3002L
DFN1006-2: leadless ultra small plastic package; 2 terminals pesd9x7.0l
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 315 pesd9x7.0l
1PS10SB82