TEA1833TS: GreenChip SMPS control IC

The TEA1833TS is a low-cost Switched Mode Power Supply (SMPS) controller IC intended for flyback topologies. The TEA1833TS operates in peak current and frequency control mode. Frequency jitter has been implemented to reduce ElectroMagnetic Interference (EMI). Slope compensation is integrated for Continuous Conduction Mode (CCM) operation.

The TEA1833TS IC features OverPower Protection (OPP). The controller accepts an overpower situation up to 200 % for a limited amount of time.

Mains undervoltage protection (brownin/brownout), output OverVoltage Protection (OVP), and OverTemperature Protection (OTP) can be implemented using a minimal number of external components.

At low-power levels, the primary peak current is set to 22 % of the maximum peak current. The switching frequency is reduced to limit the switching losses. The combination of fixed frequency operation at high output power and frequency reduction at low output power provides high efficiency over the total load range.

The TEA1833TS makes the design of low-cost, highly efficient and reliable supplies easier by requiring a minimum number of external components. The device is especially suited for medium power applications.

SOT457
数据手册 (1)
名称/描述Modified Date
GreenChip SMPS control IC (REV 1.0) PDF (252.0 kB) TEA1833TS [English]31 Aug 2015
应用说明 (1)
名称/描述Modified Date
Application Note TEA1833 (REV 1.0) PDF (426.0 kB) AN11675 [English]20 Jul 2015
用户指南 (1)
名称/描述Modified Date
TEA1833DB1361 45 W demo board (REV 1.0) PDF (547.0 kB) UM10899 [English]26 Aug 2015
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package (TSOP6); 6 leads (REV 1.0) PDF (248.0 kB) SOT457 [English]08 Feb 2016
包装 (2)
名称/描述Modified Date
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (187.0 kB) SOT457_115 [English]30 Nov 2012
Tape reel SMD; reversed product orientation 12NC ending 125 (REV 1.0) PDF (187.0 kB) SOT457_125 [English]30 Nov 2012
支持信息 (3)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
MAR_SOT457 Topmark (REV 1.0) PDF (113.0 kB) MAR_SOT457 [English]03 Jun 2013
订购信息
型号状态Package namePackage versionTopologyFeedback control integratedMinimum SR active time (μs)Driver activation voltage (mV)Driver regulation voltage (mV)Driver deactivation voltage (mV)Driver activation delay time (ns)
TEA1833TS/1ActiveTSOP6
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
TEA1833TS/1SOT457Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q3/T4, ReverseActiveTEA1833TS/1H (9353 060 19125)Standard MarkingTEA1833TS/1Always Pb-free11
Reel 7" Q1/T1ActiveTEA1833TS/1X (9353 060 19115)Standard MarkingTEA1833TS/1Always Pb-free11
GreenChip SMPS control IC TEA1833TS
Application Note TEA1833 TEA1833TS
TEA1833DB1361 45 W demo board TEA1833TS
MAR_SOT457 Topmark 74LVC2G17_Q100
plastic surface-mounted package (TSOP6); 6 leads 74LVC2G17_Q100
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
TSOP6; Tape reel SMD; standard product orientation 12NC ending 115 pesd5v0s5ud
SSL5021_SSL5031