TEA1916x: High efficient LLC resonant controller IC with integrated PFC

NXP®'s new DCM PFC + LLC resonant controller is based on NXP's novel cycle-by-cycle architecture (capacitive voltage control). The part will be released as a combo in a separate SO8 and SO16 package. The combo controller features very high efficiency at light load (10 % - 30 %) to be compliant with tomorrow's energy efficiency regulations (Energy Star v6, CoC tier 2, 80+ Platinum). The TEA1916 also features low no-load power below 75 mW and meets EuP lot6. The LLC resonant topology makes it easier to meet Common Mode Noise requirements and 200 % peak power requirements (compared to flyback).

Last but not least the part guarantees ease of design while supporting accurate burst mode and reduced audible noise.

数据手册 (2)
名称/描述Modified Date
Digital controller for high-efficiency resonant power supply (REV 1.0) PDF (423.0 kB) TEA19161T [English]10 Mar 2016
PFC controller (REV 1.0) PDF (277.0 kB) TEA19162T [English]10 Mar 2016
手册 (1)
名称/描述Modified Date
NXP® GreenChip ICs TEA1916 and TEA1995 (REV 1.0) PDF (850 B) 75017644 [English]12 Mar 2015
封装信息 (2)
名称/描述Modified Date
plastic small outline package; 16 leads; body width 3.9 mm (REV 1.0) PDF (192.0 kB) SOT109-1 [English]08 Feb 2016
plastic small outline package; 8 leads; body width 3.9 mm (REV 1.0) PDF (244.0 kB) SOT96-1 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... (REV 2.0) PDF (232.0 kB) SOT96-1_118 [English]19 Apr 2013
支持信息 (3)
名称/描述Modified Date
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Footprint for reflow soldering (REV 1.0) PDF (9.0 kB) SO-SOJ-REFLOW [English]08 Oct 2009
Footprint for wave soldering (REV 1.0) PDF (8.0 kB) SO-SOJ-WAVE [English]08 Oct 2009
订购信息
型号
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
TEA19161T/2SOT109-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1 in DrypackActiveTEA19161T/2Y (9353 087 99518)Standard MarkingTEA19161T/2Always Pb-free33
TEA19162T/2SOT96-1SO-SOJ-REFLOW SO-SOJ-WAVE
SO-SOJ-REFLOW SO-SOJ-WAVE
Reel 13" Q1/T1ActiveTEA19162T/2J (9353 088 01118)Standard MarkingTEA19162T/2Always Pb-free11
Digital controller for high-efficiency resonant power supply TEA1916X
PFC controller TEA1916X
NXP® GreenChip ICs TEA1916 and TEA1995 TEA1995T
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
plastic small outline package; 16 leads; body width 3.9 mm NPIC6C596A_Q100
plastic small outline package; 8 leads; body width 3.9 mm CBT3306_Q100
Footprint for reflow soldering NPIC6C596A_Q100
Footprint for wave soldering NPIC6C596A_Q100
SO8; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering... CBT3306_Q100
SA614A
SA612A