TFF11070HN:适合VSAT应用的低相位噪声本振发生器

频率发生器设计用于低相位噪声本振(LO)电路。

特性和优势
    • 分频器设置:16、32、64、128或256
    • 环路滤波器的内部稳压基准
    • 本振发生器,VCO范围:6.8 GHz至7.2 GHz
    • 低相位噪声
    • 三阶或四阶PLL
    • VCO牵引范围7.0 GHz的5 %
应用
    • 本地振荡器信号产生
    • 点对点无线电微波应用
    • VSAT上变频器
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
fi(RF)RF input frequency27450MHz
Pi(ref)reference input power-100dBm
VCCsupply voltage33.33.6V
ICCsupply currentVsup = 3.3 V100130mA
fo(RF)RF output frequency6.87.2GHz
φnλ(synth)synthesizer phase noise densityfoffset = 100 kHz-97-92dB/Hz
φnλ(VCO)VCO phase noise densityfoffset = 10 MHz-130dB/Hz
Po(RF)RF output powermeasured single ended [0]-7-5-3dBm
RLoutoutput return lossmeasured at demo board and de-embedded to footprint; |ΖS| = 50 Ω; |ΖL| = 50 Ω-10dB
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
TFF11070HN/N1
HVQFN24
(SOT616-1)
sot616-1_posot616-1_frReel 13" Q1/T1开发中Standard MarkingTFF11070HN/N1,118( 9352 892 73118 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1VREGVCORegulated output voltage for VCO loop filter. Connect loop filter to this pin.
2CPOUTCharge pump output.
3VTUNETuning voltage for VCO.
4NSL0Divider setting, LSB. Leave open for “1”, connect to GND for “0”.
5NSL1Divider setting. Leave open for “1”, connect to GND for “0”.
6NSL2Divider setting, MSB. Leave open for “1”, connect to GND for “0”.
7LCKDETLock detect. Lock = 2.5 V; out of lock = 0 V.
8GND1(REF)Ground for REF input. Connect this pin to the exposed diepad landing.
9IN(REF)_PReference signal, non-inverting input. Couple this AC to the source.
10IN(REF)_NReference signal, inverting input. Couple this AC to the source.
11GND2(REF)Ground for REF input. Connect this pin to the exposed diepad landing.
12VCC(REF)Supply of the internal regulated voltages. Decouple this pin against GND2(REF) (pin 11).
13VCC(DIV)Supply of the divider and PFD/CP. Decouple this pin against GND(DIV) (pin 14)
14GND(DIV)Ground of the divider. Connect this pin to the exposed diepad landing.
15n.c.not connected.
16n.c.not connected.
17GND1(BUF)Ground for RF output. Connect this pin to the exposed diepad landing.
18VCC(BUF)Supply voltage for the RF output buffer. Decouple this pin against GND2(BUF) pin (19)
19GND2(BUF)Ground for RF output. Connect this pin to the exposed diepad landing.
20BUF1_NRF output.
21BUF2_NRF output.
22BUF1_PRF output.
23BUF2_PRF output.
24GND3(BUF)Ground for RF output. Connect this pin to the exposed diepad landing.
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
TFF11070HN/N1TFF11070HN/N1,118Always Pb-free11
文档资料
档案名称标题类型格式日期
75017347Enabling the Mobile ExperienceBrochurepdf2013-02-05
PllApplet_2008-03-11LO PLL calculatorOther typezip2008-11-03
UM10484Integrated clean-up-PLL, TFF1xxxx and buffer amplifierUser manualpdf2012-10-22
SOT616-1_118HVQFN24; reel pack; standard product orientation; 12NC ending 118Packingpdf2014-01-16
sot616-1_poplastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mmOutline drawingpdf2002-10-21
sot616-1_frFootprint for reflow soldering SOT616-1Reflow solderingpdf2009-10-08
订购信息
型号订购码 (12NC)可订购的器件编号
TFF11070HN/N19352 892 73118TFF11070HN/N1,118
Enabling the Mobile Experience rf
PllApplet_2008-03-11_1 TFF1007HN
Integrated clean-up-PLL, TFF1xxxx and buffer amplifier TFF1007HN
HVQFN24; reel pack; standard product orientation; 12NC ending 118 TFF1007HN
plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm TFF11152HN
Footprint for reflow soldering SOT616-1 TFF11152HN