A2I35H060N: 3400-3800 MHz，10 W平均值，28 V Airfast LDMOS宽带集成射频放大器
特性
| TO-270WB-17 and TO-270WBG-17 Package Image |
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| A2I35H060N 3400-3800 MHz, 10 W Avg, 28 V Data Sheet (REV 0) PDF (507.2 kB) A2I35H060N [English] | 20 Apr 2016 |
应用说明 (4)
| 名称/描述 | Modified Date |
|---|---|
| AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes (REV 1) PDF (112.4 kB) AN1955 [English] | 29 Apr 2014 |
| AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages (REV 3) PDF (910.7 kB) AN1907 [English] | 13 May 2009 |
| Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 (REV 1) PDF (111.6 kB) AN1987 [English] | 12 May 2004 |
| Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 (REV 0) PDF (112.8 kB) AN1977 [English] | 09 Oct 2003 |
工程设计要点 (1)
| 名称/描述 | Modified Date |
|---|---|
| Using Data Sheet Impedances for RF LDMOS Devices (REV 0) PDF (171.0 kB) EB212 [English] | 19 Jan 2004 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| RF Products Selector Guide (REV 43) PDF (3.8 MB) SG46 [English] | 26 May 2016 |
封装信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| 98ASA00583D, TO-WB, 17.53x9.02x2.59, Pitch 9.02, 18 Pins (REV B) PDF (86.9 kB) 98ASA00583D [English] | 22 Jan 2016 |
| 98ASA00729D, TO-WB, 17.53x9.02x2.59, Pitch 1.02, 18 Pins (REV B) PDF (88.0 kB) 98ASA00729D [English] | 18 Jan 2016 |
印刷电路板
- A2I35H060N 3500 MHz PCB DXF file (REV SJ3) ZIP A2I35H060N_3500_PCB 4/20/2016
订购信息
| 型号 | 状态 | Frequency Min (Min) (MHz) | Frequency Max (Max) (MHz) | 供电电压 (Typ) (V) | P1dB (Typ) (dBm) | P1dB (Typ) (W) | 输出功率 (Typ) (W) @ Intermodulation Level at Test Signal | 测试信号 | 功率增益 (Typ) (dB) @ f (MHz) | 效率 (Typ) (%) | 热阻 (Spec)(°C/W) | 匹配 | 类型 | 模具技术 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A2I35H060NR1 | Active | 3400 | 3800 | 28 | 46.8 | 48 | 10 @ AVG | W-CDMA | 24 @ 3500 | 32.4 | 1.7 | I/O | AB, C | LDMOS |
| A2I35H060GNR1 | Active | 3400 | 3800 | 28 | 46.8 | 48 | 10 @ AVG | W-CDMA | 24 @ 3500 | 32.4 | 1.7 | I/O | AB, C | LDMOS |
封装环保信息
| 封装说明 | Outline Version | 包装 | 产品状态 | 部件编号 | 化学成分 | RoHS / Pb Free中国RoHS查询 | MSL | PPT (°C) |
|---|---|---|---|---|---|---|---|---|
| TO-270 WBG-17 | 98ASA00729D | MPQ - 500 REELPOQ - 500 BOX | Active | A2I35H060GNR1 | A2I35H060GNR1.pdf |  | 3 | 260 |
| TO-270 WB-17 | 98ASA00583D | MPQ - 500 REELPOQ - 500 BOX | Active | A2I35H060NR1 | A2I35H060NR1.pdf | | 3 | 260 |
- AN1955, Thermal Measurement Methodology of RF Power Amplifiers - Application Notes MMT20303H
- AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages mrf1570n
- Quiescent Current Control for the RF Integrated Circuit Device Family - AN1987 MMRF2010N
- Quiescent Current Control for the RF Integrated Circuit Device Family - AN1977 MMRF2010N
- Using Data Sheet Impedances for RF LDMOS Devices mrf1570n
- RF Products Selector Guide MMT20303H
- A2I35H060N 3500 MHz PCB DXF file A2I35H060N
- 98ASA00729D, TO-WB, 17.53x9.02x2.59, Pitch 1.02, 18 Pins A2I35H060N
- A2I35H060GNR1.pdf A2I35H060N
- 98ASA00583D, TO-WB, 17.53x9.02x2.59, Pitch 9.02, 18 Pins A2I35H060N
- A2I35H060NR1.pdf A2I35H060N
