BAS21J: 单个高速开关二极管
单个高速开关二极管，采用SOD323F (SC-90)极小型扁平引脚表面贴装设备（SMD）塑料封装。
BAS21J: 产品结构框图
BAS21J: 应用结构框图
sod323f_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| Single high-speed switching diode (REV 1.0) PDF (60.0 kB) BAS21J [English] | 08 Mar 2007 |
选型工具指南 (1)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| plastic surface-mounted package; 2 leads (REV 1.0) PDF (175.0 kB) SOD323F [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| Tape reel; standard product orientation 12NC ending 115 (REV 1.0) PDF (180.0 kB) SOD323F_115 [English] | 07 Nov 2012 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| BAS21J NXP Product Quality (REV 1.2) PDF (74.0 kB) BAS21J_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| BAS21J NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BAS21J_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
Design Support
- LSYMDIO_1 (REV 0.1) PDF LSYMDIO_1 5/1/1999
SPICE
- BAS21J SPICE model (REV 1.4) prm BAS21J_1 7/22/2012
订购信息
| 型号 | 状态 | Package version | Package name | 大小 (mm) | VR max (V) | VR [max] (V) | IFSM max (A) | IFSM [max] (A) | VF [max] (mV) | VFmax (mV) | IR max (nA) | IR [max] (nA) | IFRM (mA) | IFRM (mA) | Configuration | trr max (ns) | trr [max] (ns) | IF max (mA) | IF [max] (mA) | Cd [max] (pF) | Cd max. (pF) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS21J | Active | SOD323F | SOD323F | 1.7 x 1.25 x 0.7 | 300 | 300 | 3 | 3 | 1100@IF=100mA | 1100@IF=100mA | 150@VR=250V | 150@VR=250V | 1000 | 1000 | single | 50 | 50 | 250 | 250 | 2 | 2 |
| BAS21J/DG | No Longer Manufactured | SOD323F | SOD323F | 1.7 x 1.25 x 0.7 | 300 | 300 | 3 | 3 | 1100@IF=100mA | 1100@IF=100mA | 150@VR=250V | 150@VR=250V | 1000 | 1000 | single | 50 | 50 | 250 | 250 | 2 | 2 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| BAS21J | | SOD323F | Reflow_Soldering_Profile | Reel 11¼" Q1/T1 in LargePack | Active | BAS21JF (9340 609 33135) | AN | BAS21J |    | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
| Reel 7" Q1/T1 | Active | BAS21J,115 (9340 609 33115) | AN | BAS21J | | Always Pb-free | 347.0 | 1.61 | 6.21E8 | 1 | 1 |
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- BAS21J NXP Product Quality BAS21J
- BAS21J NXP® Product Reliability BAS21J
- LSYMDIO_1 BAW56W
- BAS21J SPICE model BAS21J
- plastic surface-mounted package; 2 leads pesd5v0s1uj
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Tape reel; standard product orientation 12NC ending 115 pesd5v0s1uj
- PESD5V0S1UJ_PESD12VS1UJ
- PESD5V0S1UJ_PESD12VS1UJ
