BCP69, BC869, BC69PA: 20 V,2 A PNP中等功率晶体管

PNP中等功率晶体管系列,采用表面贴装器件(SMD)塑料封装。

SOT089
数据手册 (1)
名称/描述Modified Date
20 V, 2 A PNP medium power transistors (REV 7.1) PDF (253.0 kB) BCP69_BC869_BC69PA [English]20 Oct 2011
手册 (1)
名称/描述Modified Date
Medium-power general-purpose transistors (REV 1.0) PDF (892.0 kB) 75017660 [English]26 May 2015
封装信息 (3)
名称/描述Modified Date
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm (REV 1.0) PDF (185.0 kB) SOT1061 [English]08 Feb 2016
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
plastic surface-mounted package; die pad for good heat transfer; 3 leads (REV 1.0) PDF (193.0 kB) SOT89 [English]08 Feb 2016
包装 (5)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (178.0 kB) SOT89_115 [English]28 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (178.0 kB) SOT89_135 [English]28 Nov 2012
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 (REV 1.0) PDF (261.0 kB) SOT1061_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
Tape reel SMD; standard product orientation 12NC ending 135 (REV 1.0) PDF (189.0 kB) SOT223_135 [English]07 Nov 2012
可靠性与质量信息 (18)
名称/描述Modified Date
BC69-16PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC69-16PA [English]31 Jan 2015
BC69-16PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC69-16PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC69-25PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC69-25PA [English]31 Jan 2015
BC69-25PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC69-25PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC69PA NXP Product Quality (REV 1.2) PDF (74.0 kB) BC69PA_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC69PA NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC69PA_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC869-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC869-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC869-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC869-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC869-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC869-25_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC869-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC869-25_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BC869 NXP Product Quality (REV 1.2) PDF (74.0 kB) BC869_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BC869 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BC869_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP69-16 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-16_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP69-16 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-16_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP69-25 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69-25_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP69-25 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69-25_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
BCP69 NXP Product Quality (REV 1.2) PDF (74.0 kB) BCP69_NXP_PRODUCT_QUALITY [English]31 Jan 2015
BCP69 NXP® Product Reliability (REV 1.1) PDF (82.0 kB) BCP69_NXP_PRODUCT_RELIABILITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
Design Support
SPICE
软件
订购信息
型号状态
BC869Active
BCP69-16Active
BC69PAActive
BC869-25Active
BCP69Active
BC69-25PAActive
BC69-16PAActive
BCP69-25Active
BC869-16Active
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
BC869SOT89Reel 11¼" Q1/T1 in LargePackActiveBC869,135 (9336 787 80135)CECBC869week 28, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBC869,115 (9336 787 80115)CECBC869week 28, 2003153.00.711.41E911
BC69-25PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC69-25PA,115 (9340 658 13115)BNBC69-25PAAlways Pb-free153.00.711.41E911
BC869-25SOT89Reel 7" Q1/T1ActiveBC869-25,115 (9339 753 20115)CHCBC869-25week 28, 2003153.00.711.41E911
BCP69-16SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActiveBCP69-16,115 (9340 094 30115)BCP69/16BCP69-16week 34, 2003153.00.711.41E911
Reel 11¼" Q1/T1 in LargePackActiveBCP69-16F (9340 094 30135)BCP69/16BCP69-16153.00.711.41E9
BCP69-16/ZLSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP69-16/ZLF (9340 707 67135)Standard MarkingBCP69-16/ZL153.00.711.41E9
Reel 7" Q1/T1ActiveBCP69-16/ZLX (9340 707 67115)Standard MarkingBCP69-16/ZL153.00.711.41E9
BCP69-25SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP69-25,135 (9339 693 90135)BCP69/25BCP69-25week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP69-25,115 (9339 693 90115)BCP69/25BCP69-25week 34, 2003153.00.711.41E911
BC69-16PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC69-16PA,115 (9340 658 12115)BMBC69-16PAAlways Pb-free153.00.711.41E911
BCP69SOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 11¼" Q1/T1 in LargePackActiveBCP69,135 (9339 693 80135)BCP69BCP69week 34, 2003153.00.711.41E911
Reel 7" Q1/T1ActiveBCP69,115 (9339 693 80115)BCP69BCP69week 34, 2003153.00.711.41E911
BC869-16SOT89Reel 7" Q1/T1ActiveBC869-16,115 (9340 111 30115)CGCBC869-16week 28, 2003153.00.711.41E911
BC69PASOT1061Reflow_Soldering_ProfileReel 7" Q1/T1ActiveBC69PA,115 (9340 657 48115)B3BC69PAAlways Pb-free153.00.711.41E911
20 V, 2 A PNP medium power transistors BCP69-25
Medium-power general-purpose transistors BSR43
BC69-16PA NXP® Product Reliability BC69-16PA
BC69-16PA NXP Product Quality BC69-16PA
BC69-25PA NXP® Product Reliability BC69-25PA
BC69-25PA NXP Product Quality BC69-25PA
BC69PA NXP Product Quality BC69PA
BC69PA NXP® Product Reliability BC69PA
BC869-16 NXP Product Quality BC869-16
BC869-16 NXP® Product Reliability BC869-16
BC869-25 NXP Product Quality BC869-25
BC869-25 NXP® Product Reliability BC869-25
BC869 NXP Product Quality BC869
BC869 NXP® Product Reliability BC869
BCP69-16 NXP Product Quality BCP69-16
BCP69-16 NXP® Product Reliability BCP69-16
BCP69-25 NXP Product Quality BCP69-25
BCP69-25 NXP® Product Reliability BCP69-25
BCP69 NXP Product Quality BCP69
BCP69 NXP® Product Reliability BCP69
Letter Symbols - Transistors; General PEMD16
Power Derating Curves for SMDs; General BST62
BC69-16PA SPICE model BCP69_BC869_BC69PA
BC69-25PA SPICE model BCP69_BC869_BC69PA
BC69PA SPICE model BCP69_BC869_BC69PA
BC869 SPICE model BCP69_BC869_BC69PA
BC869-16 SPICE model BCP69_BC869_BC69PA
BC869-25 SPICE model BCP69_BC869_BC69PA
BCP69 SPICE model BCP69_BC869_BC69PA
BCP69-16 SPICE model BCP69-16
BCP69-25 SPICE model BCP69-25
BCP69_1_2 BCP69-25
Tape reel SMD; standard product orientation 12NC ending 135 BZV49-C4V3
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
plastic surface-mounted package; die pad for good heat transfer; 3 leads BZV49-C9V1
Tape reel SMD; standard product orientation 12NC ending 115 BZV49-C9V1
DFN2020-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 x 2 x 0.65 mm PMEG6020EPA
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
DFN2020-3; reel pack; standard product orientation; 12NC ending 115 PMEG6020EPA
BLT81
BFU590Q
PTVSXU1UPA_SERIES