数据手册DataSheet 下载：BGA2001 硅MMIC放大器.pdf
硅MMIC放大器由带集成偏置的NPN双多晶硅晶体管组成。
产品特点
| 产品应用
|
订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BGA2001 | CMPAK-4 (SOT343R) | sot343r_po | sot343r_fr sot343r_fw | Tape reel smd | 激活 | A1 | BGA2001,115( 9340 555 86115 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BGA2001 | BGA2001,115 |   | week 52, 2003 | NA | NA |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BGA2001 (中文)：Silicon MMIC amplifier | Data sheet | 2011-03-01 | |
| 9001800MHZ：Demoboard for the BGA2001 (900 and 1800 MHz) | Application note | 1999-02-16 | |
| LNA：Demoboard for the BGA2001 | Application note | 1999-02-18 | |
| Spar_BGA2001：S-parameter BGA2001 | S-parameter | zip | 2012-06-06 |
| 1_5VG1：1_5VG1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 35G1：35G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 4_5G1：4_5G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 1_51_7G1：1_51_7G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 2G1：2G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 4G1：4G1 SPICE model | SPICE model | 00101 | 2012-06-08 |
| 4_58G1：4_58G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 2_5G1：2_5G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 3_5G1：3_5G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 1G1：1G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 47G1：47G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 22_8G1：22_8G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 3G1：3G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 3_56G1：3_56G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 2_54G1：2_54G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| 1_5G1：1_5G1 SPICE model | SPICE model | 001 | 2012-06-08 |
| SOT343R_115：CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | 2012-11-16 | |
| SOT343R_135：CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 135 | Packing | 2012-11-16 | |
| sot343r_fw：Footprint for wave soldering SOT343R | Wave soldering | 2009-10-08 | |
| sot343r_fr：Footprint for reflow soldering SOT343R | Reflow soldering | 2009-10-08 | |
| sot343r_po：plastic surface-mounted package; reverse pinning; 4 leads | Outline drawing | 2009-10-08 |
- Silicon MMIC amplifier bga2001
- Demoboard for the BGA2001 (900 and 1800 MHz) bga2001
- Demoboard for the BGA2001 bga2001
- S-parameter BGA2001 BGA2001
- 1_5VG1 SPICE model BGA2001
- 35G1 SPICE model BGA2001
- 4_5G1 SPICE model BGA2001
- 1_51_7G1 SPICE model BGA2001
- 2G1 SPICE model BGA2001
- 4G1 SPICE model BGA2001
- 4_58G1 SPICE model BGA2001
- 2_5G1 SPICE model BGA2001
- 3_5G1 SPICE model BGA2001
- 1G1 SPICE model BGA2001
- 47G1 SPICE model BGA2001
- 22_8G1 SPICE model BGA2001
- 3G1 SPICE model BGA2001
- 3_56G1 SPICE model BGA2001
- 2_54G1 SPICE model BGA2001
- 1_5G1 SPICE model BGA2001
- CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 115 BFG410W
- CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 135 BFG410W
- Footprint for wave soldering SOT343R BF908WR
- Footprint for reflow soldering SOT343R BF908WR
- plastic surface-mounted package; reverse pinning; 4 leads BF908WR
