数据手册DataSheet 下载：BGA2003 硅MMIC放大器.pdf
硅MMIC放大器由带集成偏置的NPN双多晶硅晶体管组成。
产品特点
| 产品应用
|
订购型号
| 订购型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 订购器件的编号 |
| BGA2003 | CMPAK-4 (SOT343R) | sot343r_po | sot343r_fr sot343r_fw | Tape reel smd | 激活 | A3 | BGA2003,115( 9340 555 87115 ) |
品质、可靠性及RoHS化学成分
| 订购型号 | 订购器件的编号 | RoHS / RHF | 无铅开始日期 | EFR | IFR (FIT) | MTBF（小时） | 潮湿敏感度等级 | MSL LF |
| BGA2003 | BGA2003,115 |   | week 52, 2002 | NA | NA |
产品技术资料
| 文档标题 | 类型分类 | 格式 | 更新日期 |
| BGA2003 (中文)：Silicon MMIC amplifier | Data sheet | 2010-09-14 | |
| BGA2003_2G_HIGHIIP3LNA：Demoboard For BGA2003 | Application note | 1998-10-30 | |
| LNA900MHZ：Demoboard 900 MHz LNA with the BGA2003 | Application note | 1999-02-17 | |
| WBCDMA：Demoboard W-CDMA for the BGA2003 | Application note | 1999-02-16 | |
| Spar_BGA2003：S-parameter BGA2003 | S-parameter | zip | 2012-06-06 |
| 2_510A3：2_510A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| 2_54A3：2_54A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| 2_515A3：2_515A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| 2_52A3：2_52A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| 2_525A3：2_525A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| 2_56A3：2_56A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| 2_58A3：2_58A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| 2_520A3：2_520A3 SPICE model | SPICE model | s2p | 2012-06-08 |
| SOT343R_115：CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | 2012-11-16 | |
| SOT343R_135：CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 135 | Packing | 2012-11-16 | |
| sot343r_fw：Footprint for wave soldering SOT343R | Wave soldering | 2009-10-08 | |
| sot343r_fr：Footprint for reflow soldering SOT343R | Reflow soldering | 2009-10-08 | |
| sot343r_po：plastic surface-mounted package; reverse pinning; 4 leads | Outline drawing | 2009-10-08 |
- Silicon MMIC amplifier bga2003
- Demoboard For BGA2003 bga2003
- Demoboard 900 MHz LNA with the BGA2003 bga2003
- Demoboard W-CDMA for the BGA2003 bga2003
- S-parameter BGA2003 BGA2003
- 2_510A3 SPICE model BGA2003
- 2_54A3 SPICE model BGA2003
- 2_515A3 SPICE model BGA2003
- 2_52A3 SPICE model BGA2003
- 2_525A3 SPICE model BGA2003
- 2_56A3 SPICE model BGA2003
- 2_58A3 SPICE model BGA2003
- 2_520A3 SPICE model BGA2003
- CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 115 BFG410W
- CMPAK-4; Tape reel SMD; standard product orientation 12NC ending 135 BFG410W
- Footprint for wave soldering SOT343R BF908WR
- Footprint for reflow soldering SOT343R BF908WR
- plastic surface-mounted package; reverse pinning; 4 leads BF908WR
