数据手册DataSheet 下载BGA2011 900 MHz高线性度低噪声放大器.pdf

由具有集成式偏置特性的一个NPN双多晶硅晶体管组成的硅单片微波集成电路(MMIC)放大器。

产品特点
  • 高线性度
  • 高功率增益
  • 集成式温度补偿偏置
  • 低电流
  • 低噪声
产品应用
  • 低噪声放大器,例如:CDMA、PHs、Dect等
  • RF前端
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
BGA2011TSSOP6 (SOT363)sot363_poReflow_Soldering_Profile
Wave_Soldering_Profile
Tape reel smd激活A5%BGA2011,115( 9340 563 65115 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF(小时)潮湿敏感度等级MSL LF
BGA2011BGA2011,115week 23, 2003NANA
产品技术资料
文档标题类型分类格式更新日期
BGA2011 (中文):900 MHz high linear low noise amplifierData sheetpdf2011-03-01
BGA2011_LNA_950MHz:High IP3 MMIC LNA at 900 MHzApplication notepdf2001-05-30
Spar_BGA2011:S-parameter BGA2011S-parameterzip2012-06-06
BGA2011:BGA2011 SPICE modelSPICE modelprm2012-06-08
SOT363_115:TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115Packingpdf2012-11-15
SOT363_135:TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135Packingpdf2012-11-20
SOT363_165:TSSOP6; reel pack; reversed product orientation; 12NC ending 165Packingpdf2012-11-20
SOT363_125:Tape reel SMD; reversed product orientation 12NC ending 125Packingpdf2012-11-20
MAR_SOT363:MAR_SOT363 TopmarkTop Markingpdf2013-06-03
Reflow_Soldering_Profile:Reflow Soldering ProfileReflow solderingpdf2013-09-30
Wave_Soldering_Profile:Wave Soldering ProfileWave solderingpdf2013-09-30
sot363_fw:Footprint for wave soldering SOT363Wave solderingpdf2009-10-08
sot363_po:plastic surface-mounted package; 6 leadsOutline drawingpdf2009-10-08
sot363_fr:Footprint for reflow soldering SOT363Reflow solderingpdf2010-07-13
900 MHz high linear low noise amplifier bga2011
High IP3 MMIC LNA at 900 MHz bga2011
S-parameter BGA2011 BGA2011
BGA2011 SPICE model BGA2011
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 pesd5v0l5uy
TSSOP6; reel pack; reversed product orientation; 12NC ending 165 1PS88SB82
Tape reel SMD; reversed product orientation 12NC ending 125 74LVC2G17_Q100
MAR_SOT363 Topmark BSS84AKS
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Footprint for wave soldering SOT363 BFU520Y
plastic surface-mounted package; 6 leads BFU520Y
Footprint for reflow soldering SOT363 BFU520Y