BGA2867：MMIC宽带放大器
硅单片微波集成电路(MMIC)宽带放大器，具有内部匹配电路，采用6针SOT363塑料SMD封装。
特性和优势
应用
| 产品图片 |
关键参数
| Symbol | Parameter | Conditions | Min | Typ/Nom | Max | Unit |
|---|---|---|---|---|---|---|
| VCC | supply voltage | RF input AC coupled | -0.5 | 7 | V | |
| ICC | supply current | 36 | mA | |||
| Ptot | total power dissipation | Tsp = 90 °C | 200 | mW | ||
| Gp | power gain | f = 250 MHz; VSUP = 5 V | 25.8 | 26.3 | 26.9 | dB |
| Gp | power gain | f = 950 MHz; VSUP = 5 V | 26.4 | 27.1 | 27.8 | dB |
| Gp | power gain | f = 2150 MHz; VSUP = 5 V | 24.9 | 26.4 | 27.9 | dB |
| PL(1dB) | output power at 1 dB gain compression | ISUP = 21.7 mA; f = 950 MHz; VSUP = 5 V | 5 | 7 | 8 | dBm |
| NF | noise figure | f = 950 MHz | 3.2 | 3.6 | 4.1 | dB |
| IP3o | output third-order intercept point | f2 = 951 MHz; f1 = 950 MHz; Pdrive = -40 dBm (for each tone) | 17.5 | 19.5 | dBm | |
| PL(sat) | saturated output power | f = 950 MHz | 7 | 8 | dBm | |
| B-3dB | -3 dB bandwidth | 3 dB below gain at 1 GHz; VSUP = 5 V; ISUP = 21.7 mA | 2.8 | 3 | 3.2 | GHz |
封装与包装
| 型号 | 封装 | Outline version | Reflow-/Wave soldering | 包装 | 产品状态 | 标示 | 可订购的器件编号, (订购码 (12NC)) |
|---|---|---|---|---|---|---|---|
| BGA2867 |  TSSOP6 (SOT363) | sot363_po | sot363_fr sot363_fw | Reel 7" Q1/T1 | 量产 | LP% | BGA2867,115( 9352 959 74115 ) |
引脚配置信息
| Pin | Symbol | Description | 外形简图 | 图形符号 |
|---|---|---|---|---|
| 1 | VCC | supply voltage |  |  |
| 2 | GND2 | ground 2 | ||
| 3 | RF_OUT | RF output | ||
| 4 | GND1 | ground 1 | ||
| 5 | GND2 | ground 2 | ||
| 6 | RF_IN | RF input |
无铅环保信息
| 型号 | 可订购的器件编号 | RoHS / RHF | 无铅转换日期 | 潮湿敏感度等级 | MSL LF |
|---|---|---|---|---|---|
| BGA2867 | BGA2867,115 |   | Always Pb-free | 1 | 1 |
文档资料
| 档案名称 | 标题 | 类型 | 格式 | 日期 |
|---|---|---|---|---|
| BGA2867 (中文) | MMIC wideband amplifier | Data sheet | 2015-07-13 | |
| 75017501 | Design with confidence using our latest RF discrete | Leaflet | 2014-01-07 | |
| sot363_fw | Footprint for wave soldering SOT363 | Wave soldering | 2009-10-08 | |
| sot363_po | plastic surface-mounted package; 6 leads | Outline drawing | 2009-10-08 | |
| sot363_fr | Footprint for reflow soldering SOT363 | Reflow soldering | 2010-07-13 | |
| SOT363_115 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 | Packing | 2012-11-15 | |
| MAR_SOT363 | MAR_SOT363 Topmark | Top Marking | 2013-06-03 | |
| Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | 2013-09-30 | |
| Wave_Soldering_Profile | Wave Soldering Profile | Wave soldering | 2013-09-30 |
订购信息
| 型号 | 订购码 (12NC) | 可订购的器件编号 |
|---|---|---|
| BGA2867 | 9352 959 74115 | BGA2867,115 |
- MMIC wideband amplifier bga2867
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- Footprint for wave soldering SOT363 BFU520Y
- plastic surface-mounted package; 6 leads BFU520Y
- Footprint for reflow soldering SOT363 BFU520Y
- TSSOP6; Tape reel SMD; standard product orientation 12NC ending 115 BSS84AKS
- MAR_SOT363 Topmark BSS84AKS
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
