BGU7224:2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypass

The BGU7224 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 2.4 GHz to 2.5 GHz ISM band. Manufactured in NXP's high performance SiGe:C technology, the BGU7224 couples best-in-class gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7224 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external component, makes the circuit board implementation of the BGU7224 the smallest IEEE 802.11b/g/n (including 256 QAM enabling “802.11n turbo”) LNA with bypass solution on the market, ideal for space sensitive applications.

特性和优势
    • IEEE 802.11b/g/n WiFi, WLAN (including 256 QAM enabling “802.11n turbo”)
    • Fully integrated, high performance LNA with built-in bypass
    • Integrated DC blocking at RF input and RF output, with only one external component needed
    • Low 1.0 dB noise figure with 13 mA current consumption
    • Low bypass current of 2 μA (typical)
    • Single supply 3.0 V to 3.6 V operation
    • Integrated, temperature stabilized bias network
    • Integrated concurrent 5 GHz notch filter
    • High IP3i and low EVM
    • High ESD protection of 2 kV (HBM) on all pins
    • Small, 0.5 mm pitch, 1.6 mm x 1.6 mm x 0.5 mm QFN-style package, MSL 1 at 260 °C
    • Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) following NXP’s RHF-2006 indicator D (dark green)
应用
    • IEEE 802.11b/g/n WiFi, WLAN
    • Bluetooth
    • IEEE 802.15.4 PAN
    • Smartphones, tablets, netbooks and other portable computing devices
    • Access points, routers, gateways
    • Wireless video
    • General purpose ISM applications
产品图片
演示板
OM7869
OM7869
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
ISUPsupply currentgain mode; VSUP = 3.3 V13mA
ISUPsupply currentbypass mode; VSUP = 3.3 V2µA
Pi(1dB)input power at 1 dB gain compressiongain mode; 2400 MHz < f < 2500 MHz; VSUP = 3.3 V-3dBm
Gppower gaingain mode; 2400 MHz < f < 2500 MHz; VSUP = 3.3 V [0]131517dB
Gppower gainbypass mode; 2400 MHz < f < 2500 MHz; VSUP = 3.3 V [0]-5.5dB
NFspot noise figuregain mode; 2400 MHz < f < 2500 MHz [0]1dB
封装与包装
型号封装Outline versionReflow-/Wave soldering包装产品状态标示可订购的器件编号, (订购码 (12NC))
BGU7224
DFN1616-6
(SOT1189-1)
sot1189-1_poReflow_Soldering_ProfileReel 7" Q1/T1量产Standard MarkingBGU7224X( 9340 677 72115 )
引脚配置信息
PinSymbolDescription外形简图图形符号
1CTRLgain control, switch between gain and bypass mode
2RF_INRF input
3GNDground
4GNDground
5RF_OUTRF output
6VCCsupply voltage
7GNDground
无铅环保信息
型号可订购的器件编号RoHS / RHF无铅转换日期潮湿敏感度等级MSL LF
BGU7224BGU7224XAlways Pb-free11
文档资料
档案名称标题类型格式日期
BGU7224 (中文)2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypassData sheetpdf2014-12-15
Reflow_Soldering_ProfileReflow Soldering ProfileReflow solderingpdf2013-09-30
sot1189-1_poplastic, thermal enhanced extremely thin small outline package; no leads; 6 terminalsOutline drawingpdf2010-10-21
sot1189-1_frFootprint for reflow soldering SOT1189-1Reflow solderingpdf2011-07-06
订购信息
型号订购码 (12NC)可订购的器件编号
BGU72249340 677 72115BGU7224X
2.4 GHz ISM SiGe:C low-noise amplifier MMIC with bypass bgu7224
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals BGU7258
Footprint for reflow soldering SOT1189-1 BGU7258