BGU8103UK: SiGe:C LNA MMIC for GPS, GLONASS, Galileo and Compass

The BGU8103UK is an ultra low current and Low-Noise Amplifier (LNA) for GNSS receiver applications. It comes as an extremely small and thin Wafer Level Chip Scale Package (WLCSP). This product is only used in an overmolded module. The BGU8103UK requires only one external matching inductor.

The BGU8103UK adapts itself to the changing environment resulting from co-habitation of different radio systems in modern cellular handsets. It has been designed for ultra low power consumption and optimal performance when jamming signals from co-existing cellular transmitters are present. At low jamming power levels, it delivers 18.5 dB gain at a noise figure of 0.80 dB and a supply current of 1.2 mA. During high jamming power levels, resulting for example from a cellular transmit burst, it temporarily increases its bias current to improve sensitivity.

sot1445-1_3d
数据手册 (1)
名称/描述Modified Date
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS (REV 1.0) PDF (168.0 kB) BGU8103UK [English]26 Jan 2016
应用说明 (1)
名称/描述Modified Date
BGU8103UK GNSS LNA evaluation board (REV 1.0) PDF (522.0 kB) AN11678 [English]05 Oct 2016
封装信息 (1)
名称/描述Modified Date
wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm (REV 1.1) PDF (218.0 kB) SOT1445-1 [English]12 Jul 2016
包装 (1)
名称/描述Modified Date
WLSCP6; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,019 or... (REV 1.0) PDF (201.0 kB) SOT1445-1_019 [English]28 Aug 2015
订购信息
型号状态Package version@VCC [min] (V)@VCC [max] (V)@ICC [typ] (mA)Gp [typ] (dB)NF [typ] (dB)Pi(1dB) [min] (dBm)Pi(1dB) [typ] (dBm)IP3i [min] (dBm)IP3i [typ] (dBm)@VCC (V)@f (MHz)
BGU8103UKActiveSOT1445-11.53.118.50.8-17
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期MSLMSL LF
BGU8103UKSOT1445-1Reel 13" Q1/T1 in DrypackActiveBGU8103UKAZ (9340 695 52019)Standard MarkingBGU8103UKAlways Pb-free11
SiGe:C LNA MMIC for GPS, GLONASS, Galileo and COMPASS BGU8103UK
BGU8103UK GNSS LNA evaluation board BGU8103UK
wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm BGU8103UK
WLSCP6; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending ,019 or... BGU8103UK