数据手册DataSheet 下载：BSP100 N沟道TrenchMOS中间电平FET.pdf

中间电平N沟道增强型场效应晶体管(FET)，采用使用TrenchMOS技术的塑料封装。该产品仅设计适合用于计算、通信、消费电子和工业应用。

产品特点
  • 低热阻，工作功率更高
  • 低导通电阻，因而导通损耗很小
  • 快速开关特性，适用于高频应用
  • 耐温范围宽，适用于对热性能要求苛刻的应用
产品应用
  • DC-DC转换器
  • 逻辑电平转换器
  • 马达和继电器驱动器
订购型号
订购型号封装Outline versionReflow-/Wave soldering包装产品状态标示订购器件的编号
BSP100SC-73 (SOT223)sot223_poReflow_Soldering_Profile
Wave_Soldering_Profile		Tape reel smd激活BSP100BSP100,135( 9340 334 40135 )
品质、可靠性及RoHS化学成分
订购型号订购器件的编号RoHS / RHF无铅开始日期EFRIFR (FIT)MTBF（小时）潮湿敏感度等级MSL LF
BSP100BSP100,135week 35, 2003220.01.029.79E811
产品技术资料
文档标题类型分类格式更新日期
BSP100 (中文)：N-channel enhancement mode TrenchMOS (tm) transistorData sheetpdf1999-02-01
AN10273：Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication notepdf2010-03-17
AN11158：Understanding power MOSFET data sheet parametersApplication notepdf2014-02-04
AN11243：Failure signature of Electrical Overstress on Power MOSFETsApplication notepdf2012-10-29
AN11158_ZH：Understanding power MOSFET data sheet parametersApplication notepdf2013-11-08
75017288：Broad small-signal MOSFET portfolio to suit a wide range of applicationsLine cardpdf2012-08-23
BSP100_NXP_Product_Quality：BSP100 NXP Product QualityQuality documentpdf2014-04-22
BSP100_8_20_2010：BSP100_8_20_2010 Spice parameterSPICE modellib2011-08-22
BSP100：BSP100 SPICE modelSPICE modelprm2012-06-08
SOT223_115：Tape reel SMD; standard product orientation 12NC ending 115Packingpdf2012-11-07
SOT223_135：Tape reel SMD; standard product orientation 12NC ending 135Packingpdf2012-11-07
Reflow_Soldering_Profile：Reflow Soldering ProfileReflow solderingpdf2013-09-30
Wave_Soldering_Profile：Wave Soldering ProfileWave solderingpdf2013-09-30
sot223_fw：Footprint for wave soldering SOT223Wave solderingpdf2010-07-13
sot223_po：plastic surface-mounted package with increased heatsink; 4 leadsOutline drawingpdf2009-10-08
sot223_fr：Footprint for reflow soldering SOT223Reflow solderingpdf2009-10-08
N-channel enhancement mode TrenchMOS (tm) transistor BSP100
Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7M12-60E
Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7K6R8-40E
Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
BSP100 NXP Product Quality BSP100
BSP100_8_20_2010 Spice parameter BSP100
BSP100 SPICE model BSP100
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
Tape reel SMD; standard product orientation 12NC ending 135 BUK7880-55
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Footprint for wave soldering SOT223 BLT81
plastic surface-mounted package with increased heatsink; 4 leads BLT81
Footprint for reflow soldering SOT223 BLT81
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