MSC8154E: High-Performance Quad-Core DSP with Security
The MSC8154E device is one of Our fourth-generation high-end multicore DSP devices that target broadband wireless base stations and other communications infrastructure with security processing. The MSC8154E is a four-core DSP based on NXP’s SC3850 StarCore® technology and designed to advance the capabilities of wireless broadband equipment. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 4 GHz single-core device. The MSC8154E helps equipment manufacturers and carriers create solutions and services that enable near-term, mainstream adoption of next-generation wireless standards such as 3G-LTE, WiMAX, HSPA+ and TDD-LTE. The device is designed to lower system costs by integrating functionality into a single device that previously required multiple discrete parts.
The MSC8154E DSP delivers a high level of performance and integration, combining four fully programmable new and enhanced SC3850 DSP cores, each running at up to 1 GHz with an architecture highly optimized for wireless infrastructure applications. Developed by NXP® and integrated on-chip, the MAPLE-B baseband accelerator supports hardware acceleration for Turbo and Viterbi channel decoding and for DFT/iDFT and FFT/iFFT algorithms and includes CRC processing. An internal RISC-based QUICC Engine® subsystem supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading processing from the DSP cores.
The MSC8154E embeds large internal memory and supports a variety of advanced, high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface, four multi-channel TDM interfaces and a security encryption/decryption processor (SEC).
MSC8154 Digital Signal Processor Block Diagram

MSC8154E Digital Signal Processor Product Image

特性
- Four StarCore® DSP SC3850 core subsystems operating at up to 1 GHz/8000 MMACS per core and up to 32000 MMACS per device
- Multi accelerator platform engine for baseband (MAPLE-B)
- High-speed, high-bandwidth CLASS fabric arbitrates between the DSP cores and other CLASS masters to M2 memory, M3 memory, DDR controllers, MAPLE-B and the configuration registers
- Two DDR controllers with up to 400 MHz clock (800 MHz data) rate and 32/64-bit DDR2/3 SDRAM data bus
- Dual RISC core QUICC Engine® subsystem operating at up to 500 MHz provides parallel packet processing independent of the DSP cores
- HSSI that supports two 4x SerDes ports
- Security engine core (SEC) optimized to process all the cryptographic algorithms associated with IPSec, IKE, SSL/TLS, 3GPP and LTE
- Four TDM interfaces
- UART and I²C interfaces
- Eight software watchdog timers
- Sixteen 16-bit timers, two 32-bit general purpose timers per core for RTOS support
- I/O interrupt concentrator and virtual interrupt support, eight hardware semaphores
- Thirty-two GPIO ports multiplexed with interface signals and IRQ inputs
- Boot options: Ethernet, Serial RapidIO, I²C and serial peripheral interface (SPI)
- Three input clocks and five PLLs
- JTAG Test Access Port (TAP) and boundary scan architecture designed to comply with IEEE® Std. 1149.1 profiling and performance monitoring support
- Reduced power dissipation with wait, stop and power down low-power standby modes
- Optimized power management circuitry
- CMOS 45 nm SOI technology in 29 mm x 29 mm, 783 ball FC-PBGA package
Recommended Documentation (4)
Data Sheets (1)
Application Notes (34)
Reference Manuals (2)
Product Briefs (1)
Fact Sheets (2)
Brochures (1)
Selector Guides (1)
Product Numbering Scheme (1)
订购信息
| 型号 | 状态 | 预算报价(不含税)(CNY) | 封装类型和焊端数 | Core Type | 工作频率 (Max) (MHz) | 内核:内核数量 (Spec) | 工作环境温度 (Min-Max) (°C) | 缓存 (KB) | L2缓存 (Max) (KB) | 内部RAM (KB) | 支持外部存储器 | DMA通道总数 | Ethernet Type | 其他特性 |
|---|
| MSC8154ESVT1000B | No Longer Manufactured | | FCBGA 783 | SC3850 | 1000 | 4 | 0 to 105 | 32 | 512 | | DDR2, DDR3 | 16 | 1GBaseT, SGMII | |
| MSC8154ETVT1000B | No Longer Manufactured | | FCBGA 783 | SC3850 | 1000 | 4 | -40 to 105 | 32 | 512 | | DDR2, DDR3 | 16 | 1GBaseT, SGMII | |
封装环保信息
| Package Description | Outline Version | Packing | Product Status | Part Number | Chemical Content | RoHS / Pb FreeChina RoHS Lookup | MSL | PPT (°C) |
|---|
| FCPBGA 783 29SQ3.55P1.0 | 98ARE10738D | | No Longer Manufactured | MSC8154ESVT1000B | MSC8154ESVT1000B.pdf |  | 3 | 245 |
| No Longer Manufactured | MSC8154ETVT1000B | MSC8154ETVT1000B.pdf |  | 3 | 245 |