MSC8156: High-Performance Six-Core DSP
The MSC8156 is based on the industry's highest-performance DSP core built on StarCore® technology and designed for the advanced processing requirements and capabilities of today's high-performance applications for the wireless broadband, medical imaging, aerospace, defense and advanced test and measurement markets. It delivers industry-leading performance and power savings, leveraging 45 nm process technology in a highly integrated system-on-chip (SoC) to provide performance equivalent to a 6 GHz single-core device. The MSC8156 helps equipment manufacturers create end products and services that integrate more functionality in a smaller hardware footprint.
The MSC8156 DSP delivers a high level of performance and integration, combining six fully programmable enhanced SC3850 DSP cores, each running at up to 1 GHz. Developed by NXP® and integrated on-chip, the MAPLE-B accelerator supports hardware acceleration for Turbo and Viterbi channel decoding and for DFT/iDFT and FFT/iFFT algorithms. A high-performance internal RISC-based QUICC Engine® subsystem supports multiple networking protocols to guarantee reliable data transport over packet networks while significantly offloading processing from the DSP cores.
The MSC8156 embeds large internal memory and supports a variety of advanced high-speed interface types, including two RapidIO® interfaces, two gigabit Ethernet interfaces for network communications, a PCI Express® controller, two DDR controllers for high-speed, industry standard memory interface and four multi-channel TDM interfaces. The MSC8156 allows a high degree of scalability through pin compatibility with all MSC825x and MSC815x DSP devices.
MSC8156 High-Performance Six-Core DSP Block Diagram
![MSC8156 High-Performance Six-Core DSP Block Diagram](/image/nxp/MSC8156_BD.jpg)
MSC8156 High-Performance Six-Core DSP Product Image
![MSC8156 High-Performance Six-Core DSP Product Image](/image/nxp/MSC8156_IMG.jpg)
特性
- Six StarCore® DSP SC3850 core subsystems each with:
- SC3850 DSP core at up to 1 GHz
- 512 KB unified L2 cache/M2 memory
- 32 KB I-cache, 32 KB D-cache
- Fully programmable 1056 KB M3 shared memory (SRAM)
- SC3850 DSP core at up to 1 GHz
- 512 KB unified L2 cache/M2 memory
- 32 KB I-cache, 32 KB D-cache
- Fully programmable 1056 KB M3 shared memory (SRAM)
- MAPLE-B - highly flexible programmable Turbo and Viterbi decoder supports configurable decoding parameters. It can perform up to 200 Mbps of Turbo decoding (six iterations) or up to 115 Mbps of K = 9 (zero tail) Viterbi decoding
- Two DDR 2/3 64-bit SDRAM interfaces at up to 800 MHz data rate
- Chip-Level Arbitration and Switching Fabric, non-blocking, fully pipelined, low latency
- High-speed interconnects:
- Dual 4x/1x Serial RapidIO at 1.25/2.5/3.125 Gbaud
- PCI Express 4x/1x
- Two SGMII
- Dual 4x/1x Serial RapidIO at 1.25/2.5/3.125 Gbaud
- PCI Express 4x/1x
- Two SGMII
- Dual RISC QUICC Engine® supporting:
- RGMII gigabit Ethernet ports
- Serial peripheral interface (SPI)
- RGMII gigabit Ethernet ports
- Serial peripheral interface (SPI)
- TDM highway 1024 ch., 400 Mbps, divided into four ports of 256
- DMA engine 16 bi-directional channels
- Other peripheral interfaces:
- UART
- I²C
- 32 GPIO
- 16 timers
- Technology
- Process: 45 nm SOI
- Voltage: 1-volt core, 2.5, 1.8/1.5-volt I/O
- Package: FC-BPGA (29x29) 1 mm pitch, RoHS
- Process: 45 nm SOI
- Voltage: 1-volt core, 2.5, 1.8/1.5-volt I/O
- Package: FC-BPGA (29x29) 1 mm pitch, RoHS
- This product is included in NXP®.s product longevity program, with assured supply for a minimum of 10 years after launch
Recommended Documentation (1)
Data Sheets (1)
Application Notes (38)
Reference Manuals (6)
Users Guides (1)
Product Briefs (1)
Engineering Bulletins (2)
Fact Sheets (3)
Brochures (1)
Selector Guides (1)
Package Information (1)
订购信息
型号 | 状态 | 预算报价(不含税)(CNY) | 封装类型和焊端数 | Core Type | 工作频率 (Max) (MHz) | 内核:内核数量 (Spec) | 工作环境温度 (Min-Max) (°C) | 缓存 (KB) | L2缓存 (Max) (KB) | 内部RAM (KB) | 支持外部存储器 | DMA通道总数 | Ethernet Type | 其他特性 |
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MSC8156TAG1000B | Active | 1K @ CNY1,030.76 | FCPBGA 783 | | | | | | | | | | | |
MSC8156SAG1000B | Active | 1K @ CNY937.14 | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 32 | 1000 | DDR2, DDR3, SDRAM | 16 | 1GBaseT | Memory Management Unit (MMU), PLL |
MSC8156ETAG1000B | Active | 1K @ CNY1,082.29 | FCPBGA 783 | SC3850 | 1000 | 6 | -40 to 105 | 32 | 32 | 1000 | DDR2, DDR3, SDRAM | 16 | 1GBaseT | Memory Management Unit (MMU), PLL |
MSC8156ESAG1000B | Active | 1K @ CNY983.92 | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 32 | | DDR2, DDR3, SDRAM | 16 | 1GBaseT | Memory Management Unit (MMU), PLL |
MSC8156TVT1000B | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | -40 to 105 | 32 | 32 | 1000 | DDR3, SDRAM, DDR2 | 16 | 1GBaseT | |
MSC8156SVT1000B | No Longer Manufactured | | FCPBGA 783 | SC3850 | 1000 | 6 | 0 to 105 | 32 | 32 | 1000 | DDR3, SDRAM, DDR2 | 16 | 1GBaseT | |
封装环保信息