NX3008NBKMB: 30 V,单N沟道Trench MOSFET

N沟道增强型场效应晶体管(FET),采用使用Trench MOSFET技术的无引脚超小型DFN1006-3 (SOT883)表面贴装器件(SMD)塑料封装。

-
数据手册 (1)
名称/描述Modified Date
30 V, single N-channel Trench MOSFET (REV 1.0) PDF (1.0 MB) NX3008NBKMB [English]11 May 2012
应用说明 (10)
名称/描述Modified Date
Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English]13 Jul 2016
Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English]10 Dec 2015
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English]22 May 2014
Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English]19 May 2014
Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English]04 Feb 2014
Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English]08 Nov 2013
Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English]29 Oct 2012
LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English]14 Sep 2012
LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English]16 Nov 2011
LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English]27 Jan 2011
手册 (2)
名称/描述Modified Date
适用于便携设备和移动电话... (REV 1.0) PDF (4.9 MB) 939775017444_ZH [English]28 Oct 2013
Discretes for portable devices and mobile handsets (REV 1.1) PDF (3.9 MB) 939775017444 [English]04 Sep 2013
选型工具指南 (4)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English]11 Sep 2014
Broad small-signal MOSFET portfolio to suit a wide range of applications (REV 1.0) PDF (3.3 MB) 75017288 [English]23 Aug 2012
Advanced cross reference list DFN* MOSFETs (REV 1.1) PDF (248.0 kB) 75017313 [English]19 Jun 2012
封装信息 (1)
名称/描述Modified Date
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm (REV 1.0) PDF (181.0 kB) SOT883B [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... (REV 1.0) PDF (206.0 kB) SOT883B_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
NX3008NBKMB NXP® Product Reliability (REV 1.1) PDF (84.0 kB) NX3008NBKMB_1 [English]31 Jan 2015
NX3008NBKMB NXP Product Quality (REV 1.2) PDF (74.0 kB) NX3008NBKMB_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English]07 Aug 2015
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
S-参数
订购信息
型号状态Package versionPackage nameChannel typeNumber of transistorsRDSon [max] @ VGS = 10 V (mΩ)VDS [max] (V)RDSon [max] @ VGS = 5 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)RDSon [max] @ VGS = 2.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)QG(tot) [typ] (nC)Ptot [max] (W)QG(tot) [typ] @ VGS = 10 V (nC)VGSth [typ] (V)Qr [typ] (nC)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)日期
NX3008NBKMBActiveSOT883BDFN1006B-3N130140021001500.530.080.520.520.360.9N346.52012-05-11
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
NX3008NBKMBSOT883BReflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActiveNX3008NBKMB,315 (9340 658 64315)0000 0011NX3008NBKMBAlways Pb-free149.00.691.45E911
30 V, single N-channel Trench MOSFET NX3008NBKMB
Using power MOSFETs in parallel BUK7M12-60E
Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using RC Thermal Models BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7M12-60E
Understanding power MOSFET data sheet parameters BUK7K6R8-40E
Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
LFPAK MOSFET thermal design guide BUK7M12-60E
适用于便携设备和移动电话... ptvsxs1ur_automotive
Discretes for portable devices and mobile handsets ptvsxs1ur_automotive
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
Broad small-signal MOSFET portfolio to suit a wide range of applications BSS84AKW
Advanced cross reference list DFN* MOSFETs PMZB370UNE
NX3008NBKMB NXP® Product Reliability NX3008NBKMB
NX3008NBKMB NXP Product Quality NX3008NBKMB
Power MOSFET frequently asked questions and answers BUK7M12-60E
NX3008NBKMB.07_02_2012 Spice parameter NX3008NBKMB
DFN1006B-3: leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.37 mm BC857BMB
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q3/T4 standard product orientation Orderable part number ending... BC857BMB
PMZB950UPE