NX7002BKW (中文) | 60 V, single N-channel Trench MOSFET | Data sheet | pdf | 2015-03-20 |
AN10874 | LFPAK MOSFET thermal design guide | Application note | pdf | 2011-01-27 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | pdf | 2012-09-14 |
AN11113 | LFPAK MOSFET thermal design guide - Part 2 | Application note | pdf | 2011-11-16 |
AN11261 | Using RC Thermal Models | Application note | pdf | 2014-05-19 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | pdf | 2014-05-22 |
AN11599 | Using power MOSFETs in parallel | Application note | pdf | 2015-07-07 |
75017631 | Discretes Semiconductors Selection Guide 2015 | Selection guide | pdf | 2015-01-09 |
75017590 | NXP's Power MOSFET Selection Guide 2014: Smaller, faster, cooler | Selection guide | pdf | 2014-09-11 |
sot323_po | plastic surface-mounted package; 3 leads | Outline drawing | pdf | 2009-10-08 |
Reflow_Soldering_Profile | Reflow Soldering Profile | Reflow soldering | pdf | 2013-09-30 |
sot323_fw | Footprint for wave soldering SOT323 | Wave soldering | pdf | 2010-07-13 |
sot323_fr | Footprint for reflow soldering SOT323 | Reflow soldering | pdf | 2010-07-13 |