NX7002BKW:60 V, single N-channel Trench MOSFET

N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT323 (SC-70) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

特性和优势
    • Logic-level compatible
    • Very fast switching
    • Trench MOSFET technology
    • ElectroStatic Discharge (ESD) protection > 2 kV HBM
应用
    • Relay driver
    • High-speed line driver
    • Low-side loadswitch
    • Switching circuits
产品图片
关键参数
SymbolParameterConditionsMinTyp/NomMaxUnit
VDSdrain-source voltageTj = 25 °C60V
VGSgate-source voltageTj = 25 °C-2020V
IDdrain currentVGS = 10 V; Tsp = 25 °C330mA
IDdrain currentVGS = 10 V; Tamb = 25 °C [0]240mA
RDSondrain-source on-state resistanceVGS = 10 V; ID = 200 mA; Tj = 25 °C2.22.8Ω
引脚配置信息
PinSymbolDescription外形简图图形符号
1Ggate
2Ssource
3Ddrain
文档资料
档案名称标题类型格式日期
NX7002BKW (中文)60 V, single N-channel Trench MOSFETData sheetpdf2015-03-20
AN10874LFPAK MOSFET thermal design guideApplication notepdf2011-01-27
AN10874_ZHLFPAK MOSFET thermal design guide, Chinese versionApplication notepdf2012-09-14
AN11113LFPAK MOSFET thermal design guide - Part 2Application notepdf2011-11-16
AN11261Using RC Thermal ModelsApplication notepdf2014-05-19
AN11113_ZHLFPAK MOSFET thermal design guide - Part 2Application notepdf2014-05-22
AN11599Using power MOSFETs in parallelApplication notepdf2015-07-07
75017631Discretes Semiconductors Selection Guide 2015Selection guidepdf2015-01-09
75017590NXP's Power MOSFET Selection Guide 2014: Smaller, faster, coolerSelection guidepdf2014-09-11
sot323_poplastic surface-mounted package; 3 leadsOutline drawingpdf2009-10-08
Reflow_Soldering_ProfileReflow Soldering ProfileReflow solderingpdf2013-09-30
sot323_fwFootprint for wave soldering SOT323Wave solderingpdf2010-07-13
sot323_frFootprint for reflow soldering SOT323Reflow solderingpdf2010-07-13
60 V, single N-channel Trench MOSFET NX7002BKW
LFPAK MOSFET thermal design guide BUK7M12-60E
LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
Using RC Thermal Models BUK7M12-60E
LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
Using power MOSFETs in parallel BUK7M12-60E
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
plastic surface-mounted package; 3 leads PRF947
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Footprint for wave soldering SOT323 PRF947
Footprint for reflow soldering SOT323 PRF947