PBHV8140Z: 500 V,1 A NPN高压低VCEsat (BISS)晶体管

NPN高压低VCEsat突破性小信号(BISS)晶体管,采用中等功率SOT223 (SC-73)表面贴装器件(SMD)塑料封装。PNP补充产品:PBHV9540Z。

SOT223
数据手册 (1)
名称/描述Modified Date
500 V, 1 A NPN high-voltage low V_CEsat (BISS) transistor (REV 1.0) PDF (152.0 kB) PBHV8140Z [English]29 Dec 2009
应用说明 (1)
名称/描述Modified Date
Thermal behavior of small-signal discretes on multilayer PCBs (REV 1.0) PDF (211.0 kB) AN11076 [English]12 Jul 2011
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package with increased heatsink; 4 leads (REV 1.0) PDF (198.0 kB) SOT223 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Tape reel SMD; standard product orientation 12NC ending 115 (REV 1.0) PDF (189.0 kB) SOT223_115 [English]07 Nov 2012
可靠性与质量信息 (2)
名称/描述Modified Date
PBHV8140Z NXP® Product Reliability (REV 1.1) PDF (82.0 kB) PBHV8140Z_1 [English]31 Jan 2015
PBHV8140Z NXP Product Quality (REV 1.2) PDF (74.0 kB) PBHV8140Z_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (2)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
Wave Soldering Profile (REV 1.0) PDF (20.0 kB) WAVE_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)transistor polarityTransistor polarityPtot [max] (mW)PolarityVCEO [max] (V)IC [max] (A)ICM [max] (A)hFE [min]RCEsat@IC [max]; IC/IB =10 [typ] (mΩ)hFE [typ]fT [typ] (MHz)RCEsat [typ] (mΩ)VCEsat [max] (mV)
PBHV8140ZActiveSOT223SC-736.5 x 3.5 x 1.65NPN1450NPN4001210015015525150250
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PBHV8140ZSOT223Reflow_Soldering_Profile Wave_Soldering_Profile
Reflow_Soldering_Profile Wave_Soldering_Profile
Reel 7" Q1/T1ActivePBHV8140Z,115 (9340 634 82115)V8140ZPBHV8140ZAlways Pb-free153.00.711.41E911
500 V, 1 A NPN high-voltage low V_CEsat (BISS) transistor PBHV8140Z
Thermal behavior of small-signal discretes on multilayer PCBs PBSS9110Z
PBHV8140Z NXP® Product Reliability PBHV8140Z
PBHV8140Z NXP Product Quality PBHV8140Z
PBHV8140Z SPICE model PBHV8140Z
plastic surface-mounted package with increased heatsink; 4 leads BUK7880-55A
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Tape reel SMD; standard product orientation 12NC ending 115 BUK7880-55A
BLT81