PESD5V0L2UM: 低电容双ESD保护二极管

低电容ESD保护二极管采用超小型无引脚三焊盘SOT883塑料封装,设计用于保护最多两条传输线或数据线免受静电放电(ESD)导致的损坏。

PESD5V0L2UM: 产品结构框图
SOT883
数据手册 (1)
名称/描述Modified Date
Low capacitance double ESD protection diode (REV 2.0) PDF (169.0 kB) PESDXL2UM_SER [English]23 May 2005
封装信息 (1)
名称/描述Modified Date
DFN1006-3: leadless ultra small plastic package; 3 solder lands (REV 1.0) PDF (181.0 kB) SOT883 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... (REV 2.0) PDF (150.0 kB) SOT883_315 [English]22 Jul 2016
可靠性与质量信息 (2)
名称/描述Modified Date
PESD5V0L2UM NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PESD5V0L2UM [English]31 Jan 2015
PESD5V0L2UM NXP® Product Quality (REV 1.1) PDF (74.0 kB) PESD5V0L2UM_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)No of protected linesConfigurationCd [typ] (pF)Cd [max] (pF)VRWM (V)VESD IEC61000-4-2 (kV)IRM [max] (µA)
PESD5V0L2UMActiveSOT883DFN1006-31.0 x 0.6 x 0.52Unidirectional16195150.025
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHF无铅转换日期EFRIFR(FIT)MTBF(小时)MSLMSL LF
PESD5V0L2UMSOT883Reflow_Soldering_ProfileReel 7" Q1/T1 Pitch 2mmActivePESD5V0L2UM,315 (9340 577 83315)F1PESD5V0L2UMAlways Pb-free244.01.138.85E811
Low capacitance double ESD protection diode pesd5v0l2um
PESD5V0L2UM NXP® Product Reliability pesd5v0l2um
PESD5V0L2UM NXP® Product Quality pesd5v0l2um
PESD5V0L2UM SPICE model PESDXL2UM_SERIES
DFN1006-3: leadless ultra small plastic package; 3 solder lands BSS84AKM
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Leadless ultra small package; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending... BSS84AKM
PESDXL2UM_SERIES
PMZ950UPE