PMEG3030BEP: 3 A低V_F MEGA肖特基势垒整流二极管

平面高能效通用型(MEGA)肖特基势垒整流器,带集成应力保护环,采用SOD128小型扁平引脚表面贴装设备(SMD)塑料封装。

sod128_3d
数据手册 (1)
名称/描述Modified Date
3 A low V_F MEGA Schottky barrier rectifier (REV 1.0) PDF (93.0 kB) PMEG3030BEP [English]09 Nov 2009
应用说明 (1)
名称/描述Modified Date
Thermal consideration of NXP® FlatPower MEGA Schottky barrier rectifiers - Selection criteria (REV 3.0) PDF (180.0 kB) AN10808 [English]29 Apr 2015
手册 (1)
名称/描述Modified Date
NXP® low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages (REV 1.0) PDF (986.0 kB) 75017640 [English]20 Feb 2015
选型工具指南 (1)
名称/描述Modified Date
Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English]17 Feb 2016
封装信息 (1)
名称/描述Modified Date
plastic surface-mounted package; 2 leads (REV 1.0) PDF (178.0 kB) SOD128 [English]08 Feb 2016
包装 (1)
名称/描述Modified Date
Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 (REV 1.0) PDF (140.0 kB) SOD128_115 [English]27 Mar 2014
可靠性与质量信息 (2)
名称/描述Modified Date
PMEG3030BEP NXP® Product Reliability (REV 1.1) PDF (83.0 kB) PMEG3030BEP_1 [English]31 Jan 2015
PMEG3030BEP NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMEG3030BEP_NXP_PRODUCT_QUALITY [English]31 Jan 2015
支持信息 (1)
名称/描述Modified Date
Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English]30 Sep 2013
SPICE
订购信息
型号状态Package versionPackage name大小 (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG3030BEPActiveSOD128SOD1283.8 x 2.5 x 1330single0,15@VR=30V50170@VR=10V450@IF=3A
封装环保信息
产品编号封装说明Outline Version回流/波峰焊接包装产品状态部件编号订购码 (12NC)Marking化学成分RoHS / 无铅 / RHFEFRIFR(FIT)MTBF(小时)MSLMSL LF
PMEG3030BEPSOD128Reflow_Soldering_ProfileReel 7" Q1/T1ActivePMEG3030BEP,115 (9340 614 76115)A6PMEG3030BEP157.00.731.37E911
3 A low V_F MEGA Schottky barrier rectifier PMEG3030BEP
Thermal consideration of NXP® FlatPower MEGA Schottky barrier rectifiers - Selection criteria PMEG6045ETP
NXP® low VF (MEGA) Schottky rectifiers in CFP3 and CFP5 FlatPower packages SOD123W_SOD128_AUTOMOTIVE
Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
PMEG3030BEP NXP® Product Reliability PMEG3030BEP
PMEG3030BEP NXP® Product Quality PMEG3030BEP
PMEG3030BEP SPICE model PMEG3030BEP
plastic surface-mounted package; 2 leads ptvsxp1up_automotive
Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
Reel pack, SMD, 7" T1 standard product orientation Ordering code (12NC) ending 115 ptvsxp1up_automotive
PTVSXP1UTP_SERIES