PMPB33XN: 30 V 单N沟道Trench MOSFET
N沟道增强型场效应晶体管(FET)，采用具有MOSFET技术的无引脚中等功率DFN2020MD-6 (SOT1220)表面贴装器件(SMD)塑料封装。
sot1220_3d
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| 30 V single N-channel Trench MOSFET (REV 1.0) PDF (230.0 kB) PMPB33XN [English] | 06 Jul 2012 |
应用说明 (12)
| 名称/描述 | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| Power MOSFET single-shot and repetitive avalanche ruggedness rating (REV 3.0) PDF (146.0 kB) AN10273 [English] | 10 Dec 2015 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| Understanding power MOSFET data sheet parameters (REV 4.0) PDF (571.0 kB) AN11158 [English] | 04 Feb 2014 |
| Understanding power MOSFET data sheet parameters (REV 3.0) PDF (903.0 kB) AN11158_ZH [English] | 08 Nov 2013 |
| Medium power small-signal MOSFETs in DC-to-DC conversion (REV 3.0) PDF (738.0 kB) AN11119 [English] | 07 May 2013 |
| MOSFET load switch PCB with thermal measurement (REV 1.0) PDF (881.0 kB) AN11304 [English] | 28 Jan 2013 |
| Failure signature of Electrical Overstress on Power MOSFETs (REV 1.0) PDF (10.5 MB) AN11243 [English] | 29 Oct 2012 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
选型工具指南 (3)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
| Advanced cross reference list DFN* MOSFETs (REV 1.1) PDF (248.0 kB) 75017313 [English] | 19 Jun 2012 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals (REV 1.0) PDF (212.0 kB) SOT1220 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| DFN2020MD-6; reel pack; Standard orientation; 12NC ending 115 (REV 2.0) PDF (209.0 kB) SOT1220_115 [English] | 19 Feb 2013 |
可靠性与质量信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| PMPB33XN NXP® Product Quality (REV 1.1) PDF (74.0 kB) PMPB33XN_NXP_PRODUCT_QUALITY [English] | 31 Jan 2015 |
| PMPB33XN NXP® Product Reliability (REV 1.1) PDF (84.0 kB) PMPB33XN_NXP_PRODUCT_RELIABILITY [English] | 31 Jan 2015 |
支持信息 (2)
| 名称/描述 | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English] | 07 Aug 2015 |
| Reflow Soldering Profile (REV 1.0) PDF (34.0 kB) REFLOW_SOLDERING_PROFILE [English] | 30 Sep 2013 |
SPICE
- PMPB33XN Spice model (REV 1.0) lib PMPB33XN_16_05_2012 12/13/2013
订购信息
| 型号 | 状态 | Package version | Package name | Channel type | Number of transistors | RDSon [max] @ VGS = 10 V (mΩ) | VDS [max] (V) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | Tj [max] (°C) | QGD [typ] (nC) | ID [max] (A) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | VGSth [typ] (V) | Automotive qualified | Qr [typ] (nC) | Ciss [typ] (pF) | Coss [typ] (pF) | 日期 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMPB33XN | Active | SOT1220 | DFN2020MD-6 | N | 1 | 30 | 47 | 76 | 150 | 1.3 | 5.5 | 5.1 | 5.1 | 1.5 | 0.8 | N | 505 | 57 | 2012-07-04 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | 无铅转换日期 | EFR | IFR(FIT) | MTBF（小时） | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMPB33XN | | SOT1220 | Reflow_Soldering_Profile | Reel 7" Q1/T1 | Active | PMPB33XN,115 (9340 668 69115) | 1P | PMPB33XN |    | Always Pb-free | 1145.0 | 5.31 | 1.88E8 | 1 | 1 |
- 30 V single N-channel Trench MOSFET PMPB33XN
- Using power MOSFETs in parallel BUK7M12-60E
- Power MOSFET single-shot and repetitive avalanche ruggedness rating BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7M12-60E
- Understanding power MOSFET data sheet parameters BUK7K6R8-40E
- Medium power small-signal MOSFETs in DC-to-DC conversion BAT54J
- MOSFET load switch PCB with thermal measurement pmpb40sna
- Failure signature of Electrical Overstress on Power MOSFETs BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- Advanced cross reference list DFN* MOSFETs PMZB370UNE
- PMPB33XN NXP® Product Quality PMPB33XN
- PMPB33XN NXP® Product Reliability PMPB33XN
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- PMPB33XN Spice model PMPB33XN
- DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals pmpb55enea
- Reflow_Soldering_Profile Wave_Soldering_Profile LPC1112FD20
- DFN2020MD-6; reel pack; Standard orientation; 12NC ending 115 pmpb55enea
- PMPB95ENEA
