PSMN6R1-30YLD: N-channel 30 V, 6.1 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
Logic level gate drive N-channel enhancement mode MOSFET in LFPAK56 package. NextPowerS3 portfolio utilising NXP’s unique “SchottkyPlus” technology delivers high efficiency, low spiking performance usually associated with MOSFETs with an integrated Schottky or Schottky-like diode but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency applications at high switching frequencies.
SOT669
数据手册 (1)
| 名称/描述 | Modified Date |
|---|---|
| N-channel 30 V, 6.1 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology (REV 1.4) PDF (281.0 kB) PSMN6R1-30YLD [English] | 19 Sep 2014 |
应用说明 (6)
| 名称/描述 | Modified Date |
|---|---|
| Using power MOSFETs in parallel (REV 1.0) PDF (184.0 kB) AN11599 [English] | 13 Jul 2016 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.6 MB) AN11113_ZH [English] | 22 May 2014 |
| Using RC Thermal Models (REV 2.0) PDF (1.0 MB) AN11261 [English] | 19 May 2014 |
| LFPAK MOSFET thermal design guide, Chinese version (REV 1.0) PDF (515.0 kB) AN10874_ZH [English] | 14 Sep 2012 |
| LFPAK MOSFET thermal design guide - Part 2 (REV 2.0) PDF (2.5 MB) AN11113 [English] | 16 Nov 2011 |
| LFPAK MOSFET thermal design guide (REV 2.0) PDF (401.0 kB) AN10874 [English] | 27 Jan 2011 |
选型工具指南 (2)
| 名称/描述 | Modified Date |
|---|---|
| Discretes Semiconductors Selection Guide 2016 (REV 1.0) PDF (47.9 MB) 75017631 [English] | 17 Feb 2016 |
| NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler (REV 1.0) PDF (6.2 MB) 75017590 [English] | 11 Sep 2014 |
封装信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads (REV 1.0) PDF (213.0 kB) SOT669 [English] | 08 Feb 2016 |
包装 (1)
| 名称/描述 | Modified Date |
|---|---|
| LFPAK56; Reel pack; SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,115 or... (REV 3.0) PDF (101.0 kB) SOT669_115 [English] | 09 Sep 2016 |
支持信息 (1)
| 名称/描述 | Modified Date |
|---|---|
| Power MOSFET frequently asked questions and answers (REV 1.0) PDF (1.1 MB) TN00008 [English] | 07 Aug 2015 |
SPICE
- PSMN6R1-30YLD Spice model (REV 1.0) lib PSMN6R1-30YLD_1 9/18/2013
Thermal design
- PSMN6R1-30YLD Thermal design model (REV 1.0) PDF PSMN6R1-30YLD_RC_THERMAL_MODEL 11/24/2015
Thermal model
- PSMN6R1-30YLD Thermal model (REV 1.0) pdml PSMN6R1-30YLD_1_2 9/18/2013
订购信息
| 型号 | 状态 | Package version | Package name | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 5 V (mΩ) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | RDSon [max] @ VGS = 2.5 V (mΩ) | QGD [typ] (nC) | Tj [max] (°C) | ID [max] (A) | QG(tot) [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | Qr [typ] (nC) | Ptot [max] (W) | VGSth [typ] (V) | QG(tot) [typ] @ VGS = 10 V (nC) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | 日期 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN6R1-30YLD | Active | SOT669 | LFPAK56; Power-SO8 | N | 1 | 30 | 6 | 8.35 | 1.7 | 175 | 66 | 6.4 | 6.4 | 12.6 | 47 | 1.68 | 13.6 | N | 817 | 605 | 2013-06-26 |
封装环保信息
| 产品编号 | 封装说明 | Outline Version | 回流/波峰焊接 | 包装 | 产品状态 | 部件编号订购码 (12NC) | Marking | 化学成分 | RoHS / 无铅 / RHF | MSL | MSL LF |
|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN6R1-30YLD | | SOT669 | Reel 7" Q1/T1 | Active | PSMN6R1-30YLDX (9340 677 98115) | 6D130L | PSMN6R1-30YLD |   | 1 | 1 |
- Using power MOSFETs in parallel BUK7M12-60E
- LFPAK MOSFET thermal design guide - Part 2 BUK7K8R7-40E
- Using RC Thermal Models BUK7M12-60E
- LFPAK MOSFET thermal design guide, Chinese version BUK7K8R7-40E
- LFPAK MOSFET thermal design guide - Part 2 BUK7M12-60E
- LFPAK MOSFET thermal design guide BUK7M12-60E
- Discretes Semiconductors Selection Guide 2016 BUK7M12-60E
- NXP®'s Power MOSFET Selection Guide 2014: Smaller, faster, cooler BSS84AKW
- Power MOSFET frequently asked questions and answers BUK7M12-60E
- PSMN6R1-30YLD Spice model PSMN6R1-30YLD
- PSMN6R1-30YLD Thermal design model PSMN6R1-30YLD
- PSMN6R1-30YLD Thermal model PSMN6R1-30YLD
- Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads PHPT61003PY
- LFPAK56; Reel pack; SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,115 or... PHPT61003PY
- PSMN9R5-30YLC
