NSR01F30NXT5G: Schottky Barrier Diode, 100 mA, 30 V
The Schottky diodes are optimized for low forward voltage drop and low leakage current. The DSN2 Dual Silicon No lead package is a chip level package using solderable metal contacts under the package similar to DFN style packages. The DSN style package enables 100 percent utilization of the package area for active silicon offering a significant performance per board area advantage compared to products in plastic molded packages. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements.
特性- Low Forward Voltage Drop
- High Switching Speed
- Low Reverse Current
| 优势- Reduces Power Dissipation
- Better Performance
|
应用- Buck and Boost DC-DC Converters
- Reverse Voltage and Current Protection
| 终端产品- Mobile Handsets
- MP3 Players
- Digital Camera & Camcorders
|
应用注释 (3)
数据表 (1)
仿真模型 (4)
封装图纸 (1)
产品订购型号
| 产品 | 状况 | Compliance | 封装 | MSL* | 容器 | 预算价格 (1千个数量的单价） |
|---|
| NSR01F30NXT5G | Active | AEC Qualified
Pb-free
Halide free | DSN-2 | 152AA | 1 | Die Surf Tape and Reel | 5000 | $0.05 |
订购产品技术参数
| Product | Configuration | VRRM Min (V) | VF Max (V) | IRM Max (µA) | IO(rec) Max (A) | IFSM Max (A) | trr Max (ns) | Cj Max (pF) |
|---|
| NSR01F30NXT5G | Single | 30 | 0.37 | 7 | 0.1 | 4 | - | 7 |
