BAL-CC25-01D3:50Ω nominal input / conjugate match balun to CC253x, CC254x, CC257x, CC852x, CC853x, with integrated harmonic filter

STMicroelectronics BAL-CC25-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC25xx and CC85xx RF transceivers.

It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.

Key Features

  • 2.45 GHz balun with integrated matching network
  • Matching optimized for following chip-sets:
    • CC2530, CC2531, CC2533
    • CC2540
    • CC2543, CC2544, CC2545
    • CC2570, CC2571
    • CC8520, CC8521
    • CC8530, CC82531
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated Flip-Chip on glass
  • Small footprint: < 0.88 mm²
  • Benefits
    • Very low profile
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability
产品规格
DescriptionVersionSize
DS9673: 50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun4.0467 KB
应用手册
DescriptionVersionSize
AN4315: BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers2.1688 KB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
Board Manufacturing Specifications
DescriptionVersionSize
BAL-CC25-01D3 gerber files1.0314 KB
宣传册
DescriptionVersionSize
High-quality RF IPD baluns for ISM bands simplify RF complexity.2.01 MB
手册
DescriptionVersionSize
Products and Solutions for Factory Automation and Control1.03 MB
Semiconductor solutions for healthcare applications1.0665 KB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
BAL-CC25-01D3Chip Scale Package 0.4mm pitchTape And Reel50000.113100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
BAL-CC25-01D3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2_sdm_signed.pdf
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2.xml
50 ohm, conjugate match to CC253x, CC254x, CC257x, CC852x, CC853x, transformer balun BAL-CC25-01D3
BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers BAL-NRF02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-CC25-01D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-NRF02D3
STEVAL-SPIMD20V1 demonstration kit based on the SPIMD20 integrated motor drive STEVAL-SPIMD20V1
STM8L101xx device limitations STM8L101G3
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2_sdm_signed.pdf BAL-CC25-01D3
md_6(-wspc-cspg-wspc-0.4_ld6(-wspc-blcc25a_vers2.xml BAL-CC25-01D3