BALF-SPI-02D3:50Ω / Conjugate match to SPIRIT1 433MHz Balun Transformer & Integrated Filtering

STMicroelectronics BALF-SPI-02D3 is an ultraminiature balun. The BALF-SPI-02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the SPIRIT1 ST transceiver.

The BALF-SPI-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.

Key Features

  • 50 Ω nominal input / conjugate match to SPIRIT1
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Small footprint
产品规格
DescriptionVersionSize
DS10771: 50 Ω nominal input / conjugate match balun to SPIRIT1 434 MHz, with integrated harmonic filter3.0665 KB
应用手册
DescriptionVersionSize
AN4315: BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers2.1688 KB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
High-quality RF IPD baluns for ISM bands simplify RF complexity.2.01 MB
手册
DescriptionVersionSize
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Wireless connectivity for IoT applications2.02 MB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
BALF-SPI-02D3Chip Scale Package 0.4mm pitchTape And Reel50000.188100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
BALF-SPI-02D3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_6(-wspc-cspg-wspc-0.4_ld6(blspia2-wspc-(balf-spi-02d3)-wspc-wcp-wspc-ver2_signed.pdf
md_6(-wspc-cspg-wspc-0.4_ld6(blspia2-wspc-(balf-spi-02d3)-wspc-wcp-wspc-ver2.xml
50 Ω nominal input / conjugate match balun to SPIRIT1 434 MHz, with integrated harmonic filter BALF-SPI-02D3
BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers BAL-NRF02D3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches BAL-NRF02D3
STEVAL-SPIMD20V1 demonstration kit based on the SPIMD20 integrated motor drive STEVAL-SPIMD20V1
STM8L101xx device limitations STM8L101G3
ST7540 power line modem firmware stack STEVAL-IHP005V1
md_6(-wspc-cspg-wspc-0.4_ld6(blspia2-wspc-(balf-spi-02d3)-wspc-wcp-wspc-ver2_signed.pdf BALF-SPI-02D3
md_6(-wspc-cspg-wspc-0.4_ld6(blspia2-wspc-(balf-spi-02d3)-wspc-wcp-wspc-ver2.xml BALF-SPI-02D3