CPL-WB-00C2:Wide band directional coupler with ISO port

The CPL-WB-00 is a wide band directional coupler designed to measure RF antenna output power in GSM / WCDMA applications. This CPL has been customized for wide band operating frequencies (EGSM and CELL, PCS, DCS, WCDMA Band I) with less than 0.2 dB insertion losses in the transmit bandwidth (824 MHz to 1980 MHz).

The CPL-WB has been designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. The device is delivered 100% tested in tape and reel.

Key Features

  • Flip-Chip package
  • High ESD robustness (IEC 61000-4-2 Level 4)
  • BenefitsVery low profile (< 690 μm thickness)Lead-free packageHigh RF performanceRF module size reduction
  • 50 nominal input / output impedance
  • Low Insertion Loss (< 0.2 dB)
  • Wide operating frequency range (824 MHz to 2170 MHz)
  • High directivity (typical 25 dB)
  • Small footprint: 1700 x 1200 μm
  • 34 dB typical coupling factor
产品规格
DescriptionVersionSize
DS5946: Wide band directional coupler with ISO port3.1446 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
宣传册
DescriptionVersionSize
IPADTM – integrated passive devices for RF applications2.11 MB
样片和购买
型号PackagePacking TypeMinimum Sellable QuantityUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
CPL-WB-00C2Chip Scale Package 0.5mm pitchTape And Reel50000.2511000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
CPL-WB-00C2Chip Scale Package 0.5mm pitchIndustrialEcopack2md_nk-wspc-cspg-wspc-0.5_kcnkcl0313u.pdf
md_nk-wspc-cspg-wspc-05.xml
Wide band directional coupler with ISO port CPL-WB-00C2
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches CPL-WB-00C2
md_nk-wspc-cspg-wspc-0.5_kcnkcl0313u.pdf CPL-WB-00C2
md_nk-wspc-cspg-wspc-05.xml CPL-WB-00C2