EMIF01-1003M3:Single-line EMI filter and ESD protection

The EMIF01-1003M3 is a 1 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on all pins.

Key Features

  • Single line EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering
  • Very low PCB space consumption:
    • 1.0 mm x 0.6 mm
  • Very thin package: 0.6 mm max
  • High efficiency in ESD suppression (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead free package
  • Easy layout and flexibility due to single line topology
  • Low capacitance
  • Complies with following standards
    • IEC 61000-4-2 level 4 input and output pins:
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • MIL STD 883G - Method 3015-7 Class 3B (all pins)
产品规格
DescriptionVersionSize
DS5515: 1 line IPAD™, EMI filter and ESD protection in Micro QFN package2.1137 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
手册
DescriptionVersionSize
Semiconductor solutions for healthcare applications1.0665 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF01-1003M3SOT-883Tape And Reel0.3051000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF01-1003M3SOT-883IndustrialEcopack2md_pb-wspc-vfqfpn-wspc-0.6x1-wspc-3l_7spb-wspc-emi1t1a.pdf
md_pb-wspc-vfqfpn-wspc-0.xml
1 line IPAD™, EMI filter and ESD protection in Micro QFN package EMIF01-1003M3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
STM8L101xx device limitations STM8L101G3
md_pb-wspc-vfqfpn-wspc-0.6x1-wspc-3l_7spb-wspc-emi1t1a.pdf EMIF01-1003M3
md_pb-wspc-vfqfpn-wspc-0.xml EMIF01-1003M3