EMIF05-AUD02F3:5-line EMI Filter and ESD protection for audio interface

The EMIF05-AUD02F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference.

This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV.

Key Features

  • EMI low-pass filter
  • High efficiency in EMI/ESD protection
  • High reliability offered by monolithic integration
  • Very thin package
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead-free package
  • Complies with the following standards:
    • ±2 kV (air discharge)
    • IEC 61000-4-2 level 1 (on A1, A2, A3, D1, D2, D3 pins):
      • ±2 kV (air discharge)
      • ±2 kV (contact discharge)
产品规格
DescriptionVersionSize
DS10048: EMI filter and ESD protection for audio interface1.0283 KB
应用手册
DescriptionVersionSize
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1200: Micro-bump Flip Chip: package description and recommendations for use1.0280 KB
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
HW Model & CAD Libraries
DescriptionVersionSize
EMIF05-AUD02F3 S-parameter model (.sxp)1.0366 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF05-AUD02F3Chip Scale Package 0.4mm pitchTape And Reel0.2141000NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF05-AUD02F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_n0-wspc-csps0.4-wspc-11-16_kdn0emi5h1b-wspc-(emif05-aud02f3)-wspc-revb-wspc-ver2_signed.pdf
md_n0-wspc-csps0-wspc-revb.xml
EMI filter and ESD protection for audio interface EMIF05-AUD02F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Micro-bump Flip Chip: package description and recommendations for use ESDAXLC6-1BU2
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches EMIF05-AUD02F3
md_n0-wspc-csps0.4-wspc-11-16_kdn0emi5h1b-wspc-(emif05-aud02f3)-wspc-revb-wspc-ver2_signed.pdf EMIF05-AUD02F3
md_n0-wspc-csps0-wspc-revb.xml EMIF05-AUD02F3