EMIF06-HSD04F3:6-line low capacitance IPAD™ for micro-SD card with EMI filtering and ESD protection

The EMIF06-HSD04F3 chip is a highly integrated device designed to protect the application against ESD event during the insertion of the micro-SD card.

The EMIF06-HSD04F3 must be placed close to the micro-SD card connector for efficient ESD protection.

TM: IPAD is a trademark of STMicroelectronics

Key Features

  • Very low line capacitance to compensate long PCB tracks (4.5 pF typ.)
  • 208 MHz clock frequency compliant with SD3.0 UHS-1 SDR 104 standard
  • High ESD robustness: up to ±12 kV contact
  • Lead-free package in 400 μm pitch
  • Package thickness: 500 μm typ.
  • Very low PCB space consumption
  • High reliability offer by the monolithic integration
  • Complies with the following standards:
    • IEC 61000-4-2 level 4
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)
    • ±8 kV (contact discharge)
产品规格
DescriptionVersionSize
DS10673: 6-line low capacitance IPAD™ for micro-SD card with EMI filtering and ESD protection1.0540 KB
应用手册
DescriptionVersionSize
AN4541: EMI filters for SD3.0 card high-speed SD card protection and filtering devices1.11 MB
AN2348: IPAD™ 400 µm Flip Chip: package description and recommendations for use5.0261 KB
AN1235: IPAD™ 500 µm Flip Chip: package description and recommendations for use8.0251 KB
Technical Notes & Articles
DescriptionVersionSize
TN1173: Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches4.0330 KB
样片和购买
型号PackagePacking TypeUnit Price (US$) *QuantityECCN (EU)ECCN (US)Country of Origin
EMIF06-HSD04F3Chip Scale Package 0.4mm pitchTape And Reel0.189100NECEAR99CHINA
质量和可靠性
型号PackageGradeRoHS Compliance GradeMaterial Declaration**
EMIF06-HSD04F3Chip Scale Package 0.4mm pitchIndustrialEcopack2md_n0-wspc-csps0.4-wspc-11-16_k9n0-wspc-em6hsdb_vers2_sdm_signed.pdf
md_n0-wspc-csps0.4-wspc-11-16_k9n0-wspc-em6hsdb_vers.xml
6-line low capacitance IPAD™ for micro-SD card with EMI filtering and ESD protection EMIF06-HSD04F3
EMI filters for SD3.0 card high-speed SD card protection and filtering devices EMIF03-SIM05F3
IPAD™ 400 µm Flip Chip: package description and recommendations for use HSP061-4M10
IPAD™ 500 µm Flip Chip: package description and recommendations for use CPL-WBF-00D3
Packing information for IPAD™, protection, rectifiers, thyristors and AC Switches FLC21
md_n0-wspc-csps0.4-wspc-11-16_k9n0-wspc-em6hsdb_vers2_sdm_signed.pdf EMIF06-HSD04F3
md_n0-wspc-csps0.4-wspc-11-16_k9n0-wspc-em6hsdb_vers.xml EMIF06-HSD04F3