The LSM330D is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using a CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LSM330D has dynamically user-selectable full scale acceleration range of ±2 g/±4 g/±8 g/±16 g and angular rate of ±250/±500/±2000 deg/sec.
The accelerometer and gyroscope sensors can be either activated or separately put in Low power/Power-down mode for applications optimized for power saving.
The LSM330D is available in a plastic land grid array (LGA) package.
Key Features
| Description | Version | Size |
|---|---|---|
| DS8787: iNEMO inertial module: 3D accelerometer and 3D gyroscope | 2.0 | 1 MB |
| Description | Version | Size |
|---|---|---|
| TN0018: Surface mounting guidelines for MEMS sensors in an LGA package | 5.0 | 218 KB |
| Description | Version | Size |
|---|---|---|
| MEMS and Sensors, Smart solutions for IoT and enhanced user experience | 1 MB | |
| Peripheral semiconductors for set-top box applications | 4.3 | 633 KB |
| 型号 | 制造商 | Description |
|---|---|---|
| STEVAL-MKI123V1 | LSM330D adapter board for standard DIL24 socket |
| 型号 | Package | Packing Type | Unit Price (US$) * | Quantity | ECCN (EU) | ECCN (US) | Country of Origin |
|---|---|---|---|---|---|---|---|
| LSM330DTR | LGA 3X5.5X1 28L PITCH 0.45 | Tape And Reel | - | 1000 | NEC | EAR99 | - |
| 型号 | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| LSM330DTR | LGA 3X5.5X1 28L PITCH 0.45 | Industrial | Ecopack2 |
