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STM32F439ZI：High-performance advanced line, ARM Cortex-M4 core with DSP and FPU, 2 Mbytes Flash, 180 MHz CPU, ART Accelerator, Chrom-ART Accelerator, FMC with SDRAM, TFT, HW crypto

The STM32F437xx and STM32F439xx devices are based on the high-performance ARM^®Cortex®-M4 32-bit RISC core operating at a frequency of up to 180 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all ARM® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32F437xx and STM32F439xx devices incorporate high-speed embedded memories (Flash memory up to 2 Mbyte, up to 256 kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

All devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers, a true random number generator (RNG) and a cryptographic acceleration cell.

They also feature standard and advanced communication interfaces.

Key Features

• Core: ARM® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 180 MHz, MPU, 225 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
• Memories
  • Up to 2 MB of Flash memory organized into two banks allowing read-while-write
  • Up to 256+4 KB of SRAM including 64-KB of CCM (core coupled memory) data RAM
  • Flexible external memory controller with up to 32-bit data bus: SRAM,PSRAM,SDRAM/LPSDR SDRAM , Compact Flash/NOR/NAND memories
• LCD parallel interface, 8080/6800 modes
• LCD-TFT controller up to XGA resolution with dedicated Chrom-ART Accelerator™ for enhanced graphic content creation (DMA2D)
• Clock, reset and supply management
  • 1.7 V to 3.6 V application supply and I/Os
  • POR, PDR, PVD and BOR
  • 4-to-26 MHz crystal oscillator
  • Internal 16 MHz factory-trimmed RC (1% accuracy)
  • 32 kHz oscillator for RTC with calibration
  • Internal 32 kHz RC with calibration
  • Sleep, Stop and Standby modes
  • VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM
• 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode
• 2×12-bit D/A converters
• General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
• Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 180 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
• Debug mode
  • SWD & JTAG interfaces
  • Cortex-M4 Trace Macrocell™
• Up to 168 I/O ports with interrupt capability
  • Up to 164 fast I/Os up to 90 MHz
  • Up to 166 5 V-tolerant I/Os
• Up to 21 communication interfaces
  • Up to 3 × I2 C interfaces (SMBus/PMBus)
  • Up to 4 USARTs/4 UARTs (11.25 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
  • Up to 6 SPIs (45 Mbits/s), 2 with muxed full-duplex I2 S for audio class accuracy via internal audio PLL or external clock
  • 1 x SAI (serial audio interface)
  • 2 × CAN (2.0B Active) and SDIO interface
• Advanced connectivity
  • USB 2.0 full-speed device/host/OTG controller with on-chip PHY
  • USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI
  • 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII
• 8- to 14-bit parallel camera interface up to 54 Mbytes/s
• Cryptographic acceleration: hardware acceleration for AES 128, 192, 256, Triple DES, HASH (MD5, SHA-1, SHA-2), and HMAC
• True random number generator
• CRC calculation unit
• RTC: subsecond accuracy, hardware calendar
• 96-bit unique ID

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