TC58BVG2S0HBAI4 BENAND (Built-in ECC SLCNAND)

数据手册DataSheet
产品概述
Capacity (bit)4G
Tech. node (nm)24
Page size (bit)(4096+128)×8
Block size (bit)(256K+8K)×8
I/O (bit)8
Keyword4Gbit BENAND, 3.3V, x8, 24nm, FBGA
RoHS Compatible Product(s) (#)Available
封装信息
Toshiba Package NameFBGA
Pins63
Package size9mm x 11mm
Pin pitch0.8
产品特性
项目符号条件数值单位
Access Time (1st access) (Max)--220μs
Access Time (Serial Cycle) (Min)--25nsec
Operational TemperatureTopr--40 to 85degC
Supply VoltageVCC-2.7 to 3.6V
Block Erasing Time (Typ.)tBERASE-2.5msec
Program Time (Typ.)tPROG-0.34msec
技术资料
Environment InformationCertificate Regarding EU RoHS(2011/65/EU)Controlled Substances[Apr,2016](PDF: 52KB)
Environment InformationCertificate on Content of SVHC of REACH[Apr,2016](PDF: 43KB)