TH58BVG3S0HTA00 BENAND (Built-in ECC SLCNAND)

数据手册DataSheet
产品概述
Capacity (bit)8G(4G×2)
Tech. node (nm)24
Page size (bit)(4096+128)×8
Block size (bit)(256K+8K)×8
I/O (bit)8
Keyword8Gbit BENAND, 3.3V, x8, 24nm, TSOP
RoHS Compatible Product(s) (#)Available
封装信息
Toshiba Package NameTSOP
Pins48
Package size12mm x 20mm
Pin pitch0.5
产品特性
项目符号条件数值单位
Access Time (1st access) (Max)--220μs
Access Time (Serial Cycle) (Min)--25nsec
Operational TemperatureTopr-0 to 70degC
Supply VoltageVCC-2.7 to 3.6V
Block Erasing Time (Typ.)tBERASE-2.5msec
Program Time (Typ.)tPROG-0.34μs
技术资料
Environment InformationCertificate Regarding EU RoHS(2011/65/EU)Controlled Substances[Apr,2016](PDF: 52KB)
Environment InformationCertificate on Content of SVHC of REACH[Apr,2016](PDF: 43KB)