• 简体中文
• English

IHLP-2020BZ-A1 Low Profile, High Current IHLP® Inductors

技术特性

• Shielded construction
• Lowest DCR/µH, in this package size
• Handles high transient current spikes without saturation

Datasheet

• IHLP-2020BZ-A1

3D Models (*.zip)

• 3D Models - IHLP-2020

Application Notes

• Application Note - Overview of IHLP Manufacturing Standards

Instructions

• Assembly Solder Profile - Assembly Instructions
• IHLP Solder Profile and Cleaning Guide - Assembly Instructions

Product Literature

• Capabilities - Custom Magnetics: Custom Products for Key Applications
• Selector guide - IHLP® Capabilities Matrix
• Selector Guide - Surface Mount and Axial Lead Inductors
• Selector Guide - Surface-Mount Chip Inductors for Commercial Applications (IMC, ILC, IFC, ISC, IMCH)
• Selector Guide - インダクタ - Surface Mount and Axial Lead Inductors

Reference Data

• Packaging Methods - SMD Magnetics Packaging Methods