TDP Molded, Dual-In-Line Thin Film Resistor, Through Hole Network
技术特性
- Standard rugged, molded case construction (14 pins and 16 pins)
- Highly stable thin film (500 ppm at +70 °C at 2000 h)
- Low temperature coefficient (± 25 ppm/°C)
Datasheet
Approval Documents
General Information
Lead Free
Product Literature