CSD Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom)
技术特性
- Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
- Monolithic construction
- Ceramic package with no cavity. 4 pins to 20 pins.
Datasheet
Approval Documents
- Certificate - ISO 9001 Certificate of Registration
- Certification - ISO 14001 Certification of Registration
General Information
- Land Patterns - Vishay Dale Thin Film Land Patterns
Lead Free
- Lead-Free Family Summary Sheet - Resistor Components - Resistor and Plasma Display Lead-Free Product Family-2011
Ordering Info
- Ordering Info - Application Guide Form for Vishay Thin Film
Product Literature
- Capabilities - Thin Film Resistor Networks - Precision Thin Film Technology
- Product Sheet - Quick-Net® Thin Film Precision Resistor Networks
- CSD 60046
- Certificate 60013
- Certification 60033
- Land Patterns 60013
- Lead-Free Family Summary Sheet - Resistor Components 60013
- Ordering Info 60047
- Capabilities 60013
- Product Sheet 60013
- CSD Ceramic Sandwich, Dual-In-Line Thin Film Resistor, Through Hole Network (Custom) 60046
