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RFLW 3N High Frequency Wire Bondable RF Spiral Inductor, 0.030" x 0.030"

技术特性

• High frequency
• Wire bond assembly
• Small size: 0.030" x 0.030" x 0.020"

Datasheet

• RFLW 3N

Packaging Information

• Waffle Pack Packaging - Vishay Electro-Films Waffle Pack Quantity Per Product Family

Product Literature

• Product Sheet - RFLW - Wire Bondable RF Spiral Inductor
• Selector Guide - インダクタ - Surface Mount and Axial Lead Inductors

S-Parameters (*.zip)

• RFLW - RFLW S-Parameter files